APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS
    1.
    发明申请
    APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS 审中-公开
    装置加热器的装置和方法

    公开(公告)号:US20160268156A1

    公开(公告)日:2016-09-15

    申请号:US15065430

    申请日:2016-03-09

    CPC classification number: H01L21/6838 H01L21/67288

    Abstract: An apparatus tor fixing a wafer, including a chuck having a surface, a plurality of through bores in the chuck extending through the surface of the chuck, a fixed vacuum bellows, and a plurality of floating air bearings, wherein the fixed vacuum bellows and a respective floating air bearing of the plurality of floating air bearings are each individually arranged in separate through bores of the plurality of through bores and elevationally above the surface of the chuck.

    Abstract translation: 一种固定晶片的装置,包括具有表面的卡盘,在卡盘中延伸穿过卡盘表面的多个通孔,固定的真空波纹管和多个浮动空气轴承,其中固定的真空波纹管和 多个浮动空气轴承的各自的浮动空气轴承各自分别布置在多个通孔的分开的通孔中并且在卡盘的表面上方。

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