公开(公告)号：US09905340B2

公开(公告)日：2018-02-27

申请号：US15102711

申请日：2014-11-19

Applicant: KOA CORPORATION

Inventor： Sohei Koda ,  Yuya Takeue

IPC: H01C7/00 ,  H01C17/00 ,  H01C17/065 ,  H01C17/28 ,  H01C1/142

CPC classification number: H01C7/003 ,  H01C1/142 ,  H01C7/00 ,  H01C17/006 ,  H01C17/065 ,  H01C17/28 ,  H01C17/281 ,  H01C17/283

Abstract: A method for manufacturing a chip resistive element including a substrate, a resistor formed on the substrate, and electrodes connected to opposite ends of the resistor, the method including an electrode forming step of forming the electrodes on the substrate. The electrode forming step includes a step of forming a first electrode layer on the substrate using a first electrode material containing silver, and a step of forming a second electrode layer on the first electrode layer using a second electrode material containing silver and palladium. The first electrode material has a higher silver content than the second electrode material.