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1.
公开(公告)号:US12087501B2
公开(公告)日:2024-09-10
申请号:US17698326
申请日:2022-03-18
Inventor: Joseph Ambrose Wolf
IPC: H01F41/04 , B22F10/85 , B22F12/90 , B28B1/00 , B28B17/00 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , H01C17/065 , H01G4/33 , B29L31/34 , H05K1/16
CPC classification number: H01F41/043 , B22F10/85 , B22F12/90 , B28B1/001 , B28B17/0081 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00 , H01C17/065 , H01G4/33 , B29L2031/3406 , H05K1/162 , H05K1/165 , H05K1/167
Abstract: Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.
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公开(公告)号:US11802076B2
公开(公告)日:2023-10-31
申请号:US17487666
申请日:2021-09-28
Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
Inventor: Hongkun Shen
CPC classification number: C03C8/16 , C03C8/02 , H01C1/01 , H01C1/14 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/28 , C03C2204/00 , C03C2205/00
Abstract: A lead-free glass paste, a chip resistor and a method for producing the same are provided. The lead-free glass paste includes 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent.
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公开(公告)号:US09959957B2
公开(公告)日:2018-05-01
申请号:US14997459
申请日:2016-01-15
Inventor: Seiji Tsuda , Shogo Nakayama , Takeshi Iseki , Kazutoshi Matsumura
CPC classification number: H01C1/14 , G03F7/40 , H01C7/003 , H01C17/003 , H01C17/06 , H01C17/065 , H01C17/24 , H01C17/28 , H01C17/281
Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
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公开(公告)号:US09916920B2
公开(公告)日:2018-03-13
申请号:US15496383
申请日:2017-04-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masashi Morikami , Hiroyuki Kishishita , Takeshi Takeda , Osamu Nakao , Tomoyo Kitagawa
IPC: H01C10/32 , H01C17/065 , H01C1/01 , H01C1/142
CPC classification number: H01C10/32 , H01C1/01 , H01C1/142 , H01C17/065
Abstract: A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z≦4.0 and Z×L
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公开(公告)号:US20170229220A1
公开(公告)日:2017-08-10
申请号:US15496383
申请日:2017-04-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masashi MORIKAMI , Hiroyuki KISHISHITA , Takeshi TAKEDA , Osamu NAKAO , Tomoyo KITAGAWA
IPC: H01C10/32 , H01C1/01 , H01C1/142 , H01C17/065
CPC classification number: H01C10/32 , H01C1/01 , H01C1/142 , H01C17/065
Abstract: A rotary variable resistor includes an insulating substrate, a resistor pattern and a current collector pattern that are provided on the insulating substrate, a rotor that is mounted on the insulating substrate in a rotatable manner, and a slider that is mounted on the rotor and makes sliding contact with the resistor pattern and the current collector pattern to cause the resistor pattern and the current collector pattern to be conducted to each other. When a maximum dimension of the resistor pattern, which defines a variable resistor, is Z [mm] and electric linearity is L [%], Z≦4.0 and Z×L
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公开(公告)号:US20160379740A1
公开(公告)日:2016-12-29
申请号:US15263382
申请日:2016-09-13
Applicant: Battelle Memorial Institute
Inventor: Amy M. Heintz , Katherine P. Mitchell , Brett R. Burton , Ioan I. Feier , Timothy J. Lastrapes , Beth Muszynski
IPC: H01C17/065 , H05B3/26 , H01C17/28 , H05B3/14
CPC classification number: H01C17/065 , H01C17/06 , H01C17/281 , H05B3/145 , H05B3/26 , H05B3/267 , H05B3/565 , H05B2203/013 , H05B2203/017 , H05B2214/04 , Y10T29/49083 , Y10T29/49099
Abstract: Laminated resistive heaters comprising a carbon nanotube layer are described. The invention also includes methods of making laminated resistive heaters and applications using the resistive heaters.
Abstract translation: 描述了包括碳纳米管层的层压电阻加热器。 本发明还包括使用电阻加热器制造层压电阻加热器和应用的方法。
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公开(公告)号:US08994491B2
公开(公告)日:2015-03-31
申请号:US13716982
申请日:2012-12-17
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Yong Min Kim , Jung Il Kim , Ichiro Tanaka , Young Tae Kim , Heun Ku Kang
IPC: H01C1/012 , H01C7/00 , H01C17/00 , H01C17/065
CPC classification number: H01C7/00 , H01C7/003 , H01C17/006 , H01C17/065 , H01C17/06526 , Y10T29/49082
Abstract: There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu—Ni).
Abstract translation: 提供了片式电阻器及其制造方法。 芯片电阻器包括陶瓷基板; 形成在所述陶瓷基板的表面上的粘合部; 和形成在粘接部分上的电阻器,其中粘合部分包括铜(Cu),镍(Ni)和铜 - 镍(Cu-Ni)中的至少一种。
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公开(公告)号:US20140263267A1
公开(公告)日:2014-09-18
申请号:US14203139
申请日:2014-03-10
Applicant: CertainTeed Corporation
Inventor: Robert L. JENKINS , Stephen A. KOCH , Gregory F. JACOBS
IPC: E04D13/10 , H01C17/065
CPC classification number: E04D13/103 , H01C17/065 , H05B3/12 , H05B3/145 , H05B3/146 , H05B3/262 , H05B3/265 , H05B3/267 , H05B3/34 , H05B3/347 , H05B3/58 , H05B2203/002 , H05B2203/003 , H05B2203/005 , H05B2203/011 , H05B2203/013 , H05B2203/017 , H05B2203/037 , H05B2214/02 , Y10T29/49083
Abstract: A roofing product can include a heater. In an embodiment, the heater can have different areas that have different heat flux capacities, different portions having heater elements of different lengths or a combination thereof. The roofing product can be installed so that an area of the roof that has a higher heat load, such as near an eave and a valley of the roof, can receive more heat. In another embodiment, the roofing product includes an overhang section that includes at least a portion of the heater. The roofing product can be installed, and the overhang section can be coupled to an object that extends beyond an edge of the roof or over a plane defined by a roof. Many different manufacturing techniques can be used to form the heaters.
Abstract translation: 屋顶产品可以包括加热器。 在一个实施例中,加热器可以具有不同的具有不同热通量的区域,具有不同长度的加热器元件的不同部分或其组合。 可以安装屋顶产品,使得具有较高热负荷的屋顶的区域(例如靠近屋檐和屋顶的山谷)可以获得更多的热量。 在另一个实施例中,屋顶产品包括包括加热器的至少一部分的伸出部分。 可以安装屋顶产品,并且悬伸部分可以联接到延伸超出屋顶边缘或由屋顶限定的平面上的物体。 可以使用许多不同的制造技术来形成加热器。
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公开(公告)号:US20140145818A1
公开(公告)日:2014-05-29
申请号:US13685982
申请日:2012-11-27
Applicant: Amphenol Corporation
Inventor: David John Geer
IPC: H01C17/242 , H01C7/00
CPC classification number: H01C17/242 , H01C7/008 , H01C17/003 , H01C17/065
Abstract: A method of constructing a thermistor includes forming a semiconductor ceramic substrate. The method also includes coating a surface of the substrate with contact material and applying a solder mask on the contact material. The applying includes applying the solder mask to one or more portions of the contact material to leave an exposed area without the solder mask and a masked area with the solder mask. The method includes trimming the contact material at the masked area to adjust a resistance of the thermistor.
Abstract translation: 构成热敏电阻的方法包括形成半导体陶瓷基板。 该方法还包括用接触材料涂覆基板的表面并在接触材料上施加焊接掩模。 施加包括将焊接掩模施加到接触材料的一个或多个部分以留下没有焊接掩模的暴露区域和具有焊接掩模的掩蔽区域。 该方法包括在掩模区域修剪接触材料以调节热敏电阻的电阻。
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10.
公开(公告)号:US20130342227A1
公开(公告)日:2013-12-26
申请号:US14010013
申请日:2013-08-26
Applicant: ABB AG
Inventor: Adrian HOZOI , Rolf DISSELNKÖTTER , Marek PAVLAS
CPC classification number: H01C1/00 , G01R15/04 , G01R19/0084 , H01C7/003 , H01C7/22 , H01C17/065
Abstract: A resistive structure has an improved electric field profile deposited on the surface of a cylindrical insulating substrate. At least one resistive path or trace is provided with a helix-looking shape and is directly printed on the surface of the insulating substrate. A resistive voltage divider includes first and second resistors electrically connected in series, where each resistor is made of one or more traces of electrically resistive film material applied onto a cylindrical insulating substrate. At least one of the traces is shaped like a helix and is applied onto the substrate by direct printing.
Abstract translation: 电阻结构具有沉积在圆柱形绝缘衬底的表面上的改进的电场分布。 至少一个电阻路径或轨迹具有螺旋形外观形状,并直接印刷在绝缘基片的表面上。 电阻分压器包括串联电连接的第一和第二电阻器,其中每个电阻器由施加到圆柱形绝缘基板上的一个或多个电阻膜材料迹线制成。 轨迹中的至少一个成形为类似螺旋状并通过直接印刷施加到基底上。
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