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公开(公告)号：US11911217B2
公开(公告)日：2024-02-27
申请号：US16338855
申请日：2017-09-26
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： William Ossmann , Bernard Joseph Savord , Wojtek Sudol , Stephen Davies
CPC classification number: A61B8/4461 , A61B8/0883 , A61B8/12 , A61B8/445 , A61B8/4488 , A61B8/466 , A61B8/56
Abstract: An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.
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公开(公告)号：US11426140B2
公开(公告)日：2022-08-30
申请号：US16338820
申请日：2017-10-03
Applicant: KONINKLIJKE PHILIPS N.V.
Inventor： Wojtek Sudol , William John Ossmann , Stephen Davies
Abstract: An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.
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