-
公开(公告)号：US12128443B2
公开(公告)日：2024-10-29
申请号：US17514989
申请日：2021-10-29
发明人： Wojtek Sudol
IPC分类号： B06B1/02 , A61B8/00 , A61B8/12 , B81C1/00 , H01L23/00 , H01R9/05 , H01R12/62 , H01R43/20 , H05K3/34
CPC分类号： B06B1/0292 , A61B8/12 , A61B8/4483 , B06B1/02 , B81C1/00349 , H01L24/46 , H01R9/0515 , H01R12/62 , H01R43/205 , H05K3/3421 , H05K2201/09409 , H05K2201/10356 , Y02P70/50
摘要： An integrated circuit die is disclosed that comprises a substrate defining a plurality of circuit elements; a sensor region on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells; and an interposer region on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts for contacting the integrated circuit die to a connection cable and mounting pads for mounting a passive component on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.
-
公开(公告)号：US11504091B2
公开(公告)日：2022-11-22
申请号：US16338788
申请日：2017-10-03
发明人： Wojtek Sudol , Anjali Saini , Junho Song , Hyunggyun Lee , Mike Lavy
IPC分类号： A61B8/00 , A61B8/12 , B06B1/06 , H01L41/311 , H01L41/293
摘要： An imaging assembly for an intraluminal device is provided. In one embodiment, the imaging assembly includes: an array of ultrasound transducer elements spaced apart by air kerfs; a plurality of buffer elements surrounding the array of ultrasound transducer elements, wherein the plurality of buffer elements are spaced apart by gaps; and a sealing material filling portions of the gaps between the plurality of buffer elements.
-
公开(公告)号：US20210275142A1
公开(公告)日：2021-09-09
申请号：US16338788
申请日：2017-10-03
发明人： Wojtek Sudol , Anjali Saini , Junho Song , Hyunggyun Lee , Mike Lavy
摘要： An imaging assembly for an intraluminal device is provided. In one embodiment, the imaging assembly includes: an array of ultrasound transducer elements spaced apart by air kerfs; a plurality of buffer elements surrounding the array of ultrasound transducer elements, wherein the plurality of buffer elements are spaced apart by gaps; and a sealing material filling portions of the gaps between the plurality of buffer elements.
-
公开(公告)号：US11426140B2
公开(公告)日：2022-08-30
申请号：US16338820
申请日：2017-10-03
摘要： An imaging catheter assembly is provided. The imaging catheter assembly includes an interposer including a multi-layered substrate structure, wherein the multi-layered substrate structure includes a first plurality of conductive contact pads coupled to a second plurality of conductive contact pads via a plurality of conductive lines; an imaging component coupled to the interposer via the first plurality of conductive contact pads; and an electrical cable coupled to the interposer via the second plurality of conductive contact pads and in communication with the imaging component.
-
公开(公告)号：US20200214670A1
公开(公告)日：2020-07-09
申请号：US16338855
申请日：2017-09-26
摘要： An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.
-
6.发明申请公开(公告)号：US20180125463A1
公开(公告)日：2018-05-10
申请号：US15862894
申请日：2018-01-05
发明人： Richard Edward Davidsen , Michael Scarsella , James Christopher Taylor , Andrew Lee Robinson , Wojtek Sudol
CPC分类号： A61B8/546 , A61B8/4444 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B2018/00023 , G01S7/52079 , G01S15/8915 , G10K11/004
摘要： A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.
-
公开(公告)号：US11957513B2
公开(公告)日：2024-04-16
申请号：US17271115
申请日：2019-08-30
发明人： Wojtek Sudol
CPC分类号： A61B8/4455 , A61B8/4483 , B06B1/0622
摘要： The present disclosure advantageously describes ultrasound imaging arrays that comprise ergonomic, non-rectangular shapes, as well as associated systems and methods. Non-rectangular transducer arrays allow for ergonomic probe shapes that improve patient comfort, maneuverability of the ultrasound device, and operator workflow. For example, an ultrasound imaging device can include an array of acoustic elements comprising a non-rectangular perimeter. The array includes a plurality of active elements configured to emit ultrasound energy and receive echoes corresponding to the emitted ultrasound energy, and a plurality of buffer elements surrounding the plurality of active elements at the non-rectangular perimeter of the array of acoustic elements. An edge seal comprising a sealing material is positioned at least partially around the plurality of buffer elements, and a buffer element of the plurality of buffer elements is spaced from at least one other buffer element by the sealing material of the edge seal.
-
公开(公告)号：US11737728B2
公开(公告)日：2023-08-29
申请号：US16489857
申请日：2018-02-27
CPC分类号： A61B8/445 , A61B8/12 , A61B8/4488 , A61B8/4494 , A61B8/546 , A61M25/0009 , A61M25/0108
摘要： A device for imaging within a body of a patient is provided. In one embodiment, the device includes a flexible elongate member that can be inserted into the body of the patient. The device also has an imaging assembly that is disposed at and extending a length of a distal portion of the flexible elongate member. The imaging assembly may include an array (302) of imaging elements that may have an outward surface and an inward surface. The imaging assembly may further include an integrated circuit (304) adjacent to the inward surface of the array of imaging elements. The device may further include a conductive plate (375) adjacent to and extending at least a portion of a length of the imaging assembly. The conductive plate may receive heat generated by at least one of the array of imaging elements or the integrated circuit.
-
公开(公告)号：US11278932B2
公开(公告)日：2022-03-22
申请号：US14914019
申请日：2014-08-18
发明人： George Anthony Brock-Fisher , Richard Edward Davidsen , Carl Dean Herickhoff , Bout Marcelis , Wojtek Sudol , Junho Song
摘要： The invention relates to a capacitive micro-machined ultrasound transducer (CMUT) cell (6) comprising a cell floor (31) having a first electrode (7); a cell membrane (5) having a second electrode (7′) which opposes the first electrode and vibrates during transmission or reception of acoustic energy; a transmitter/receiver coupled to the first and second electrodes which causes the cell membrane to vibrate at an acoustic frequency and/or receives signals at an acoustic frequency; and an acoustic lens (13), overlaying the cell membrane, and having an inner surface opposing the cell membrane and an outer, patient-facing surface. According to the present invention the acoustic lens comprises at least one layer of a material selected from the group of: polybudatiene, polyether block amide (PEBAX), polydimethylsiloxane (PDMS) and buthylrubber.
-
公开(公告)号：US11161146B2
公开(公告)日：2021-11-02
申请号：US15757170
申请日：2016-08-19
发明人： Wojtek Sudol
IPC分类号： A61B8/12 , B06B1/02 , H01R9/05 , H01R12/62 , H01R43/20 , H05K3/34 , A61B8/00 , H01L23/00 , B81C1/00
摘要： An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.
-
-
-
-
-
-
-
-
-
搜索结果
20 条记录 (耗时 0.017 秒)
