Abstract:
Disclosed is a nonvolatile memory device including a memory cell having a transistor in which a structure is formed to be programmable and a method of fabricating the memory device. The memory cell includes one transistor serving as a basic structure, a gate insulating layer is formed of an insulating layer or a variable resistor, and a channel region includes a diode region, a source-drain connecting region, or an insulating isolation layer. The diode region, source-drain connecting region, or insulating isolation layer is formed in a region including a channel region between the source and drain regions in the semiconductor substrate. The gate includes a conductive layer, and the gate insulating layer includes an insulating layer or a variable resistor, a portion of the gate insulating layer between the gate and the diode region serves as a storage layer.