公开(公告)号：US20210292565A1

公开(公告)日：2021-09-23

申请号：US17203338

申请日：2021-03-16

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Sang Woo KIM ,  Sanghye KIM ,  Heejung LEE

IPC: C08L101/12 ,  B33Y10/00 ,  B33Y70/00 ,  C08K3/04 ,  C08K3/08 ,  C08K7/06 ,  C08K9/04 ,  C08K5/09

Abstract: Provided are a conductive composite resin composition for photocurable 3D printing and a preparation method thereof. The conductive composite resin composition for photocurable three-dimensional (3D) printing includes 10 to 90 wt % of a photoreactive viscosity decreasing agent and 10 to 90 wt % of a photocurable resin based on 100 wt % of the conductive composite resin composition, wherein the conductive composite resin composition further comprises 0.01 to 1 wt % of conductive nanostructures, and the conductive composite resin composition has a viscosity of 400 cP or less at a shear rate of 58 s−1.