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1.发明申请公开(公告)号：US20180358146A1
公开(公告)日：2018-12-13
申请号：US15990824
申请日：2018-05-29
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
Inventor： Ji-Won CHOI , Jin Sang KIM , Chong Yun KANG , Seong Keun KIM , Seung Hyub BAEK , Sang Tae KIM , Won Jae LEE , Narendra Singh PARMAR , Young-Shin LEE
IPC: H01B1/22 , H01L29/20 , H01L21/288
Abstract: The present disclosure relates to a paste for ohmic contact to p-type semiconductor, including a metal oxide and a binder, wherein the metal oxide is a rhenium oxide or a molybdenum oxide.
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