公开(公告)号：US07019403B2

公开(公告)日：2006-03-28

申请号：US10652136

申请日：2003-08-29

申请人： Katherine M. Devanie ,  Lane V. Brown ,  Michael L. Johnson

发明人： Katherine M. Devanie ,  Lane V. Brown ,  Michael L. Johnson

IPC分类号： H01L23/48 ,  H05K7/10

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/10253 ,  H05K3/3484 ,  H05K2201/0129 ,  H05K2201/10719 ,  H05K2203/0191 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/00

摘要： A self supported underfill film adhesively bonds surface mount integrated circuit packages to a printed circuit board. The printed circuit board has conductive traces and exposed conductive pads on the surface. Solder paste is printed on the conductive pads, and one or more additional solder paste deposits are printed in an area outside the conductive pads to serve as tack pads for a film adhesive. The film adhesive is strategically positioned on the printed circuit board over the tack pads and near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

摘要翻译： 自支撑的底部填充膜将表面贴装集成电路封装粘合到印刷电路板上。 印刷电路板具有导电迹线和表面上暴露的导电焊盘。 将焊膏印刷在导电焊盘上，并且一个或多个另外的焊膏沉积物印刷在导电焊盘外部的区域中，以用作胶粘剂的粘合垫。 薄膜粘合剂在印刷电路板上定位在定位焊盘上并靠近导电焊盘，然后将表面安装集成电路封装放置在板上，使得封装上的导电焊盘与板上的导电焊盘对准 。 当封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充物以增加焊点的机械完整性。