公开(公告)号：US12108524B2

公开(公告)日：2024-10-01

申请号：US17532105

申请日：2021-11-22

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Toshikazu Harada

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0278 ,  H05K3/0044 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2203/068

Abstract: A printed board includes a laminate in which insulating base members formed of the same material are laminated with conductor patterns. The printed board includes a bent part that is thinner than first and second substrate portions. A first main surface is located on an inner peripheral side and a second main surface is located on an outer peripheral side of the printed board. The first and second substrate portions each include an outermost insulating base member connected to an outermost insulating base member of the bent portion. The bent part includes a first conductor pattern closer to the first main surface and a second conductor pattern closer to the second main surface. A distance from the first conductor pattern to the first main surface is greater than a distance from the second conductor pattern to the second main surface. No interlayer connection conductors are located in the bent part.

公开(公告)号：US20240182743A1

公开(公告)日：2024-06-06

申请号：US18574478

申请日：2022-08-22

Applicant: SEKISUI POLYMATECH CO., LTD.

Inventor： Shinichi Tomooka ,  Kanae Miyanaga

IPC: C09D131/02 ,  C09D171/12 ,  H05K1/03

CPC classification number: C09D131/02 ,  C09D171/12 ,  H05K1/036 ,  H05K2201/0129

Abstract: To provide a coating film-forming composition used for forming a coating film that is a protective film having a high capability to protect a circuit wire or sensor electrode and a small thickness and a circuit sheet or sensor sheet that includes a circuit wire or sensor electrode protected with the coating film. Provided is a circuit sheet or sensor sheet that includes a thermoplastic resin including at least one selected from an epoxy resin, a phenoxy resin, polyvinyl alcohol, polyvinyl acetal, polyvinyl butyral, and an ethylene-vinyl alcohol copolymer and having a hydrogen-bonding functional group and a glass transition temperature Tg of 70° C. or more and 150° C. or less.

公开(公告)号：US11987031B2

公开(公告)日：2024-05-21

申请号：US17329818

申请日：2021-05-25

Applicant: Samsung Display Co., Ltd.

Inventor： Jun Namkung ,  Sujin Jung ,  Hyunkyu Choi

IPC: B32B3/00 ,  B32B3/26 ,  B32B3/30 ,  B32B7/12 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/28 ,  B32B27/36 ,  H05K3/28 ,  H05K3/38

CPC classification number: B32B3/30 ,  B32B3/263 ,  B32B7/12 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/06 ,  B32B27/281 ,  B32B27/36 ,  H05K3/281 ,  B32B2250/03 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/51 ,  B32B2405/00 ,  B32B2457/08 ,  B32B2457/10 ,  B32B2457/20 ,  B32B2571/00 ,  H05K3/285 ,  H05K3/387 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2203/0557

Abstract: A protection tape for a printed circuit board (PCB) includes an insulating base plate, a conductive layer over the insulating base plate, and an adhesive layer over the conductive layer, the adhesive layer including a main part having a first thickness and a subsidiary part having a second thickness less than the first thickness, the main part corresponding to at least a center portion of the insulating base plate and the subsidiary part being arranged at an outside of the main part.

公开(公告)号：US11937370B2

公开(公告)日：2024-03-19

申请号：US17463571

申请日：2021-09-01

Applicant: UNIFLEX Technology Inc.

Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H01L33/60 ,  H01L33/62 ,  H05K1/03

CPC classification number: H05K1/0274 ,  H05K1/115 ,  H05K3/28 ,  H05K3/46 ,  H05K3/4605 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0313 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

公开(公告)号：US11912863B2

公开(公告)日：2024-02-27

申请号：US17414646

申请日：2019-11-06

Applicant: MEP EUROPE B.V.

Inventor： Bernardus Antonius Gerardus Schrauwen

IPC: H05K1/03 ,  C08L69/00 ,  C08K3/22 ,  H05K3/10

CPC classification number: C08L69/00 ,  C08K3/2279 ,  H05K1/0373 ,  H05K3/105 ,  C08K2003/2231 ,  C08K2003/2241 ,  C08K2201/005 ,  H05K2201/0129 ,  H05K2201/10098

Abstract: A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition.

公开(公告)号：US20240008168A1

公开(公告)日：2024-01-04

申请号：US18225273

申请日：2023-07-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHIO

IPC: H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0242 ,  H05K1/028 ,  H01P3/081 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/0129 ,  H05K2201/09681

Abstract: When viewed in an up-down direction, a first line-shaped reference conductor layer extends along a first signal conductor layer such that portions thereof overlap. When viewed in the up-down direction, the first line-shaped reference conductor layer meanders such that one or more first projecting portions projecting from the first signal conductor layer in a first orthogonal direction and one or more second projecting portions projecting from the first signal conductor layer in a second orthogonal direction alternate in a transmission direction. A section of at least one or more first pairs of projecting portions excluding both ends thereof is not connected to a conductor layer other than one or more of the one or more first projecting portions and one or more of the one or more second projecting portions included in the at least one or more first pairs of projecting portions.

公开(公告)号：US20230340226A1

公开(公告)日：2023-10-26

申请号：US17800610

申请日：2021-02-16

Applicant: SHPP GLOBAL TECHNOLOGIES B.V.

Inventor： Yunan CHENG ,  Yun ZHENG

IPC: C08K3/22 ,  C08K7/28 ,  H05K3/18 ,  H05K3/10 ,  H05K1/16

CPC classification number: C08K3/22 ,  C08K7/28 ,  H05K3/182 ,  H05K3/105 ,  H05K1/165 ,  C08K2003/2231 ,  C08K3/2279 ,  H05K2203/107 ,  H05K2201/10098 ,  H05K2203/1136 ,  H05K2201/0129

Abstract: Disclosed is a composition comprising: from about 10 wt. % to about 90 wt. % of a thermoplastic resin, wherein the thermoplastic resin comprises a polyphenylene sulfide resin; from about 0.01 to 10 wt. % of a laser direct structuring additive; from about 0.01 wt. % to about 50 wt. % of laser breakable filler, wherein the composition exhibits a dissipation factor of less than 0.01 at frequencies of 1 GHz to 20 GHz frequencies when measured using a dielectric resonator, and wherein the combined weight percent value of all components does not exceed 100 wt. %, and all weight percent values are based on the total weight of the composition.

公开(公告)号：US20230300988A1

公开(公告)日：2023-09-21

申请号：US18014831

申请日：2021-06-30

Applicant: Dätwyler Schweiz AG

Inventor： Ronny VRIJENS ,  Matthias SODDEMANN ,  Daniel Joel GLOOR

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/12

CPC classification number: H05K3/0064 ,  H05K1/0277 ,  H05K1/0393 ,  H05K3/12 ,  H05K2201/0133 ,  H05K2201/0129

Abstract: A method for producing an elastomeric component, preferably an elastomeric sealing component, including an elastomer body and a printed structure, preferably a printed electronic structure or circuit, on a surface of the elastomer body. The method includes: a. providing a planar foil of thermoplastic material having a printable surface; b. printing a structure onto the printable surface to obtain the printed structure; c. providing an elastomer substrate for forming the elastomer body; d. placing the planar foil with the printed structure onto the elastomer substrate; and e. laminating the combined planar foil and elastomer substrate by applying heat and pressure. The elastomeric component is obtained in that the elastomer substrate is formed to the shape of the elastomer body before step d); the elastomer substrate is formed to the shape of the elastomer body during lamination; or the elastomer substrate is formed to the shape of the elastomer body after lamination.

公开(公告)号：US20230262876A1

公开(公告)日：2023-08-17

申请号：US18193696

申请日：2023-03-31

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mineto MITSUHASHI ,  Takeshi EDA ,  Taichi FURUKAWA

IPC: H05K1/02

CPC classification number: H05K1/024 ,  H05K2201/0141 ,  H05K2201/0129

Abstract: A laminate structure that includes: a resin film containing a thermoplastic resin and having a plurality of voids; and a conductor layer adjacent to a main surface of the resin film, wherein a first set of voids of the plurality of voids are localized between a first position proximal to an end surface of the resin film facing the conductor layer and a second position distant from the first position by one-third of the thickness of the resin film in a lamination direction of the resin film and the conductor layer such that the first set of voids between the first position and the second position are greater in number than a second set of voids between the second position and a third position distant from the second position by one-third of the thickness of the resin film in a direction away from the first position in the lamination direction.

公开(公告)号：US20230209703A1

公开(公告)日：2023-06-29

申请号：US17927204

申请日：2021-05-21

Applicant: Scio Holding GmbH

Inventor： Marius Sillmann ,  Jürgen Goldmann ,  Franz Padinger

IPC: H05K1/02 ,  B60R13/00 ,  H05K3/12 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0274 ,  B60R13/005 ,  H05K3/1216 ,  H05K1/185 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/10022 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/10303 ,  H05K2201/09736

Abstract: The invention relates to a method for manufacturing a component (1) comprising a printed circuit board (2) and a number of electrical components (3) arranged thereon. According to the invention, the electrical components (3) are pre-fixed on the printed circuit board (2), which is formed of plastic, by means of a fixing adhesive (9) and then completely encapsulated with an UV-adhesive (8).