公开(公告)号：US20180264519A1

公开(公告)日：2018-09-20

申请号：US15757170

申请日：2016-08-19

Applicant: KONINKLIJKE PHILIPS N.V.

Inventor： Wojtek Sudol

IPC: B06B1/02 ,  A61B8/12 ,  B81C1/00 ,  H05K3/34 ,  A61B8/00 ,  H01L23/00 ,  H01R12/62 ,  H01R43/20 ,  H01R9/05

CPC classification number: B06B1/0292 ,  A61B8/12 ,  A61B8/4483 ,  B06B1/02 ,  B81C1/00349 ,  H01L24/46 ,  H01L2924/19105 ,  H01R9/0515 ,  H01R12/62 ,  H01R43/205 ,  H05K3/3421 ,  H05K2201/09409 ,  H05K2201/10356 ,  Y02P70/613

Abstract: An integrated circuit die (1) is disclosed that comprises a substrate (30) defining a plurality of circuit elements; a sensor region (10) on the substrate, the sensor region comprising a layer stack defining a plurality of CMUT (capacitive micromachined ultrasound transducer) cells (11); and an interposer region (60) on the substrate adjacent to the sensor region. The interposer region comprises a further layer stack including conductive connections to the circuit elements and the CMUT cells, the conductive connections connected to a plurality of conductive contact regions on an upper surface of the interposer region, the conductive contact regions including external contacts (61) for contacting the integrated circuit die to a connection cable (410) and mounting pads (65) for mounting a passive component (320) on the upper surface. A probe including such an integrated circuit die an ultrasound system including such a probe are also disclosed.

公开(公告)号：US10076037B2

公开(公告)日：2018-09-11

申请号：US15687763

申请日：2017-08-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kunihiko Minegishi

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3613 ,  H05K1/111 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09409 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Provided is a printed circuit board including: an electronic component having a bottom face and a side face, in which first lands are provided on the bottom face; a printed wiring board having a mounting face, in which second lands corresponding to the first lands are provided on the mounting face, and in which the electronic component is mounted such that the bottom face faces the mounting face; a solder aggregation member provided outside the second lands on the mounting face; pieces of first solder each of which joins each of the first lands to corresponding one of the second lands; second solder formed on the solder aggregation member; and a thermosetting resin adhered to the bottom face of the electronic component outside the first lands and to the mounting face of the printed wiring board outside the second lands.

公开(公告)号：US20180247768A1

公开(公告)日：2018-08-30

申请号：US15553430

申请日：2015-12-21

Applicant: Epcos AG

Inventor： Markus Koini ,  Jürgen Konrad ,  Franz Rinner ,  Markus Puff ,  Monika Stadlober ,  Georg Kügerl ,  Thomas Wippel

IPC: H01G4/38 ,  H01G4/248 ,  H01G4/232 ,  H05K1/18

CPC classification number: H01G4/38 ,  H01G2/06 ,  H01G4/228 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H01R43/26 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).

公开(公告)号：US20180242461A1

公开(公告)日：2018-08-23

申请号：US15543652

申请日：2016-01-11

Applicant: Automotive Lighting Reutlingen GmbH

Inventor： Narcis Barqueros ,  Martin Gottheil ,  Michael Hiegler ,  Uwe Bormann

IPC: H05K3/30 ,  H05K3/34 ,  F21S41/20 ,  F21S41/141 ,  F21S41/19 ,  H05K1/18 ,  B23K1/00

CPC classification number: H05K3/305 ,  B23K1/0016 ,  B23K2101/40 ,  F21S41/141 ,  F21S41/19 ,  F21S41/285 ,  F21Y2115/10 ,  H05K1/0269 ,  H05K1/181 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/166 ,  Y02P70/613

Abstract: A method for placing an SMD semiconductor light source component and a component of an illumination device for a motor vehicle. The SMD semiconductor light source component is operated so as to generate light, and the emission characteristics of the SMD semiconductor light source component are determined. In a subsequent step, the SMD semiconductor light source component and the component are positioned relative to one another in accordance with the emission characteristics.

公开(公告)号：US20180235080A1

公开(公告)日：2018-08-16

申请号：US15956472

申请日：2018-04-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Peter Riel

IPC: H05K1/02 ,  H05K3/34 ,  B23K1/00 ,  B23K1/008 ,  B23K35/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0272 ,  B23K1/0016 ,  B23K1/008 ,  B23K35/025 ,  H05K1/0269 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3431 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/09663 ,  H05K2201/09745 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10121 ,  H05K2203/0445 ,  H05K2203/048 ,  H05K2203/0571 ,  H05K2203/166 ,  Y02P70/611 ,  Y02P70/613

Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.

公开(公告)号：US20180156426A1

公开(公告)日：2018-06-07

申请号：US15724896

申请日：2017-10-04

Applicant: GE Lighting Solutions, LLC

Inventor： Yongli Feng ,  Yong fen Chen ,  Brian Morgan Spahnie ,  Yan Ni

IPC: F21V19/00 ,  F21V23/00 ,  F21S4/28 ,  F21K9/90

CPC classification number: F21V19/005 ,  F21K9/90 ,  F21S4/28 ,  F21V23/002 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H05K3/0058 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10106 ,  Y02P70/613

Abstract: An LED module having improved bonding features is described. In some embodiments, an LED module includes at least one LED light source, at least one wire, and a housing that has a rear wall having a surface. A flow channel is cut into at least one portion of the surface of the rear wall, which provides additional surface area when glue is applied to affix the housing of the LED module to a substrate.

公开(公告)号：US09986647B2

公开(公告)日：2018-05-29

申请号：US14454165

申请日：2014-08-07

Applicant: AbleGo Technology Co., Ltd.

Inventor： Shu-Hui Hung

IPC: H05K3/30

CPC classification number: H05K3/305 ,  H05K2201/10977 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49155 ,  Y10T29/5193

Abstract: This invention provides a method and apparatus for manufacturing electronic devices. The method includes: providing a substrate having a first surface; providing an electronic device having bumps; mounting the bumps to the first surface to form an integrated unit; applying a capillary underfill to multiple sides of the electronic device, enabling the underfill to creep along and fill the gap between the electronic device and the substrate; placing the integrated unit into a processing chamber; raising the temperature in the chamber to a first predetermined temperature; reducing the pressure in the chamber to a first predetermined pressure of a vacuum pressure, and maintaining the vacuum pressure for a predetermined time period; raising the pressure in the chamber to a second predetermined pressure higher than 1 atm, and maintaining the second predetermined pressure for a predetermined time period; and adjusting the temperature in the chamber to a second predetermined temperature.

公开(公告)号：US09970597B2

公开(公告)日：2018-05-15

申请号：US14602989

申请日：2015-01-22

Applicant: OMRON Corporation

Inventor： Kensuke Nambu

IPC: F21K9/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: F21K9/20 ,  H05K1/114 ,  H05K1/189 ,  H05K3/3442 ,  H05K2201/09254 ,  H05K2201/10106 ,  H05K2201/10136 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10522 ,  H05K2203/046 ,  Y02P70/613

Abstract: A flexible printed circuit board on which a first electronic component and a second electronic component are to be mounted adjacent to each other has a first land for soldering a terminal of the first electronic component on a side adjacent to the second electronic component, and a second land for soldering a terminal of the second electronic component on a side adjacent to the first electronic component. The first land and the second land are connected by a wire extending outside of an inter-land region that is an approximately belt-shaped region formed by connecting end portions in a width direction or end portions in a thickness direction of the first land and the second land in a straight line.

公开(公告)号：US20180114646A1

公开(公告)日：2018-04-26

申请号：US15851110

申请日：2017-12-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soon-Ju LEE ,  Young-Ghyu AHN ,  Kyoung-Jin JUN ,  Sang-Soo PARK ,  So-Yeon SONG ,  Heung-Kil PARK

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/12 ,  H01G4/012 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/232 ,  H05K3/3436 ,  Y02P70/613

Abstract: A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.

公开(公告)号：US09955586B2

公开(公告)日：2018-04-24

申请号：US14800751

申请日：2015-07-16

Applicant: REALTEK SEMICONDUCTOR CORP.

Inventor： Ting-Ying Wu ,  Cheng-Lin Wu ,  Chin-Yuan Lo ,  Wen-Shan Wang

IPC: H05K7/10 ,  H05K3/34 ,  H01L23/498 ,  H01L23/50 ,  H05K7/00 ,  H05K7/12 ,  H05K1/02

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H05K1/0215 ,  H05K1/0289 ,  H05K2201/10159 ,  H05K2201/10704 ,  H05K2201/10712 ,  H05K2201/10719 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A Ball Grid Array (BGA) formed on printed circuit board is provided. The BGA comprises a first solder ball module and a second solder ball module. The first solder ball module comprises a plurality of first solder balls, wherein one of the first solder balls is grounded for shielding two other first solder balls, and one of the first solder balls is floating. The second solder ball module comprises a plurality of second solder balls, wherein two of the second solder balls are grounded and one of the two grounded second solder balls penetrates the printed circuit board through a plated through hole formed on the printed circuit board for shielding two first solder balls among the first solder balls.