摘要:
A detector device of the present invention detects densities of components, such as gasoline and ethanol, contained in mixture fuel even when some water is included in the mixture fuel. The detector device includes a sensor having a pair or electrodes, an electronic device for calculating the densities and a memory device for storing permittivities of pure components including water measured beforehand. Alternating current having two different frequencies f1, f2 is applied to the pair of electrodes immersed in the mixture fuel to detect the permittivities of the mixture fuel under f1 and f2. The two frequencies, f1 and f2, are so chosen that the premittivities of gasoline and ethanol show no change between f1 and f2, while the permittivitiy of water shows a substantial difference between f1 and f2. The electronic device calculates the densities of the components based on permittivities of the mixture fuel detected by the sensor and those of components stored in the memory device.
摘要:
A fluid sensor detects property of fluid by dipping the sensor in the fluid. The sensor includes: a semiconductor substrate; and a comb-teeth electrode made of a first diffusion layer and disposed on a first surface of the substrate. Although the comb-teeth electrode is capable of directly contacting the fluid without a protection film, corrosion resistance of the sensor against the fluid is improved. Further, since the sensor has no protection film, the sensor can detect the property accurately.
摘要:
An impedance sensor for detecting a mixing ratio of a liquid or a gas includes a substrate, at least a pair of electrodes, and a protective film. The substrate is configured to be disposed in the liquid or the gas. The pair of electrodes is disposed on the substrate. The protective film is disposed on the substrate so as to cover the pair of electrodes. The protective film is made of a material having a relative permittivity greater than or equal to 6.
摘要:
A semiconductor device includes a molding resin layer and a semiconductor element encapsulated with the molding resin layer. The molding resin layer has an opening. A surface of the semiconductor element is partially exposed outside the molding resin layer through the opening. A groove is located in the surface of the semiconductor element around the opening of the molding resin layer. The groove is filled with the molding resin layer to produce anchor effect that enhances adhesive force of the molding resin layer to the surface of the semiconductor element around the opening.
摘要:
A semiconductor device includes a molding resin layer and a semiconductor element encapsulated with the molding resin layer. The molding resin layer has an opening. A surface of the semiconductor element is partially exposed outside the molding resin layer through the opening. A groove is located in the surface of the semiconductor element around the opening of the molding resin layer. The groove is filled with the molding resin layer to produce anchor effect that enhances adhesive force of the molding resin layer to the surface of the semiconductor element around the opening.
摘要:
An ultrasonic sensor for detecting an object includes: a piezoelectric element having a piezoelectric body and first and second electrodes for sandwiching the piezoelectric body; an acoustic matching element having a reception surface, which receives an ultrasonic wave reflected by the object; and a circuit electrically coupled with the piezoelectric element via a wire. The piezoelectric element is embedded in the acoustic matching element so that the acoustic matching element covers at least the first electrode, a part of a sidewall of the piezoelectric element and a part of the wire between the circuit and the piezoelectric element, and the sidewall of the piezoelectric element is adjacent to the first electrode.
摘要:
An ultrasonic sensor for detecting an object includes: a piezoelectric element having a piezoelectric body and first and second electrodes for sandwiching the piezoelectric body; an acoustic matching element having a reception surface, which receives an ultrasonic wave reflected by the object; and a circuit electrically coupled with the piezoelectric element via a wire. The piezoelectric element is embedded in the acoustic matching element so that the acoustic matching element covers at least the first electrode, a part of a sidewall of the piezoelectric element and a part of the wire between the circuit and the piezoelectric element, and the sidewall of the piezoelectric element is adjacent to the first electrode.
摘要:
An ultrasonic sensor includes an ultrasonic detecting element, an acoustic matching member, and an oscillation damping member. The ultrasonic detecting element detects an ultrasonic wave. The acoustic matching member has a receiving surface that is adapted on a side of the certain object to be exposed to a space, in which the detected body exists. The receiving surface receives the ultrasonic wave reflected by the detected body. The acoustic matching member is made of a material having an acoustic impedance larger than that of air and smaller than that of the ultrasonic detecting element. The oscillation damping member is disposed between an attachment portion and the acoustic matching member. The attachment portion is adapted for attaching the ultrasonic sensor to the certain object. The oscillation damping member damps transmission of oscillation from the certain object to the acoustic matching member.
摘要:
An ultrasonic sensor includes an ultrasonic detector for detecting an ultrasonic wave, an acoustic matching member joined to the ultrasonic detector, a housing in which the ultrasonic detector and the acoustic matching member are accommodated, a vibration isolator located between the acoustic matching member and an inner side wall of the housing to damp an unwanted vibration from outside, and a cushion member located between the ultrasonic detector and an inner bottom wall of the housing to absorb external force applied to the ultrasonic sensor The cushion member is not in contact with the acoustic matching member.
摘要:
An ultrasonic sensor includes an ultrasonic detector for detecting an ultrasonic wave, an acoustic matching member joined to the ultrasonic detector, a housing in which the ultrasonic detector and the acoustic matching member are accommodated, a vibration isolator located between the acoustic matching member and an inner side wall of the housing to damp an unwanted vibration from outside, and a cushion member located between the ultrasonic detector and an inner bottom wall of the housing to absorb external force applied to the ultrasonic sensor The cushion member is not in contact with the acoustic matching member.