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公开(公告)号:US20210310700A1
公开(公告)日:2021-10-07
申请号:US15734643
申请日:2020-10-14
Inventor: Heon LEE , Pil-Hoon JUNG , Soomin SON , Dongwoo CHAE , Yuting LIU
IPC: F24S70/25 , F24S50/80 , F24S70/225
Abstract: The present invention discloses a radiative cooling device and a method of manufacturing the same. Specifically, the radiative cooling device according to an embodiment of the present invention includes a reflective layer formed on a substrate and responsible for reflecting sunlight having wavelengths corresponding to ultraviolet, visible, and near-infrared regions; and a radiative cooling layer formed on the reflective layer and responsible for absorbing sunlight having a wavelength corresponding to a mid-infrared region and emitting the sunlight as heat, wherein the radiative cooling layer includes a first radiation layer including an uneven pattern; and a second radiation layer formed on the first radiation layer and having a refractive index different from that of the first radiation layer.