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公开(公告)号:US20210310700A1
公开(公告)日:2021-10-07
申请号:US15734643
申请日:2020-10-14
Inventor: Heon LEE , Pil-Hoon JUNG , Soomin SON , Dongwoo CHAE , Yuting LIU
IPC: F24S70/25 , F24S50/80 , F24S70/225
Abstract: The present invention discloses a radiative cooling device and a method of manufacturing the same. Specifically, the radiative cooling device according to an embodiment of the present invention includes a reflective layer formed on a substrate and responsible for reflecting sunlight having wavelengths corresponding to ultraviolet, visible, and near-infrared regions; and a radiative cooling layer formed on the reflective layer and responsible for absorbing sunlight having a wavelength corresponding to a mid-infrared region and emitting the sunlight as heat, wherein the radiative cooling layer includes a first radiation layer including an uneven pattern; and a second radiation layer formed on the first radiation layer and having a refractive index different from that of the first radiation layer.
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2.
公开(公告)号:US20220163271A1
公开(公告)日:2022-05-26
申请号:US17110489
申请日:2020-12-03
Inventor: Heon LEE , Dongwoo CHAE , Soomin SON , Hangyu LIM
Abstract: The present invention relates to a technique of cooling a temperature on the surface or under a material by emitting heat under a radiative cooling device to the outside while minimizing the absorption of light in a solar spectrum by forming a paint coating layer with excellent radiative cooling performance on various surfaces. A radiative cooling device according to an embodiment of the present invention may include a paint coating layer formed by coating or dyeing on various surfaces a paint solution mixed with nano or microparticles of which a particle size and a composition are determined in consideration of infrared emissivity and reflectance to incident sunlight in a wavelength range corresponding to a sky window and a binder mechanically connecting the surfaces of the nano or microparticles in a solvent.
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