公开(公告)号：US06345947B1

公开(公告)日：2002-02-12

申请号：US09187513

申请日：1998-11-05

申请人： Kouji Egashira

发明人： Kouji Egashira

IPC分类号： B65H128

CPC分类号： H01L21/67781 ,  Y10S414/137 ,  Y10S414/138

摘要： A substrate arranging apparatus has a carrier support table 40 for supporting thereon carriers C holding a plurality of wafers in arranged in a row, first support mechanisms 42, 43 capable of moving upward relative to the table 40 to support the wafers contained in the carriers C, and a second support mechanism 60 capable of supporting the even or the odd wafers among the wafers supported by the first support mechanisms 60 and of raising the wafers supported thereon relative to the rest of the wafers. The first support mechanisms 42, 43 or the second support mechanism is able to turn through an angle of 180° relative to the other. As a result, the wafer are arranged in a front-to-front and back-to-back disposition. Thus, the carrier support table, the loader mechanism and the substrate arranging section are integrally combined and the time needed for the transfer of the wafers is shortened.

摘要翻译： 基板布置装置具有载体支撑台40，用于支撑其上保持排列成一排的多个晶片的载体C，能够相对于工作台40向上移动的第一支撑机构42,43，以支撑包含在载体C中的晶片 以及第二支撑机构60，其能够支撑由第一支撑机构60支撑的晶片中的偶数或奇数晶片，并且相对于其余的晶片升高支撑在其上的晶片。 第一支撑机构42,43或第二支撑机构能够相对于另一个转过180°的角度。 结果，晶片被布置成从前到后和背靠背配置。 因此，承载支撑台，装载机构和基板排列部分被整体组合，缩短了晶片传送所需的时间。

公开(公告)号：US06532975B1

公开(公告)日：2003-03-18

申请号：US09635465

申请日：2000-08-11

申请人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

发明人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

IPC分类号： B08B300

CPC分类号： H01L21/67754 ,  H01L21/67051 ,  Y10S134/902 ,  Y10S414/138

摘要： An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

摘要翻译： 可以水平地移动能够围绕转子（24）的外覆盖壁（26）和内覆盖壁（27）。 晶片载架等待部分（30）设置在转子（24）的正下方。 包括在提升器（40）中的晶片保持构件（41）移动到包含晶片（W）的晶片载体（C）中并安装在包括在晶片载体等待部分（30）中的台（31）（滑台32）上 ），提升晶片（W）并将晶片（W）传送到转子（24）。 外覆盖壁（26）或内覆盖壁（27）围绕转子（24）以限定处理室。 保持在转子（24）上的晶片（W）在处理室中进行清洁处理。

公开(公告)号：US06799586B2

公开(公告)日：2004-10-05

申请号：US10349098

申请日：2003-01-23

申请人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

发明人： Yuji Kamikawa ,  Kouji Egashira ,  Koji Tanaka

IPC分类号： B08B304

CPC分类号： H01L21/67754 ,  H01L21/67051 ,  Y10S134/902 ,  Y10S414/138

摘要： An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a wafer lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

摘要翻译： 可以水平地移动能够围绕转子（24）的外覆盖壁（26）和内覆盖壁（27）。 晶片载架等待部分（30）设置在转子（24）的正下方。 包括在晶片升降器（40）中的晶片保持构件（41）移动到包含晶片（W）的晶片载体（C）中并且安装在包括在晶片载体等待部分（30）中的载物台（31）（滑动台32）上 ），提升晶片（W）并将晶片（W）传送到转子（24）。 外覆盖壁（26）或内覆盖壁（27）围绕转子（24）以限定处理室。 保持在转子（24）上的晶片（W）在处理室中进行清洁处理。