公开(公告)号：US20130206315A1

公开(公告)日：2013-08-15

申请号：US13805843

申请日：2010-11-12

申请人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

发明人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

IPC分类号： H05K9/00

CPC分类号： H05K9/0088 ,  Y10T156/10

摘要： Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

摘要翻译： 提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。

公开(公告)号：US09167735B2

公开(公告)日：2015-10-20

申请号：US13805843

申请日：2010-11-12

申请人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

发明人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

IPC分类号： H05K9/00

CPC分类号： H05K9/0088 ,  Y10T156/10

摘要： Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

摘要翻译： 提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。

公开(公告)号：US20100189901A1

公开(公告)日：2010-07-29

申请号：US12376893

申请日：2007-08-02

申请人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Byung Hun Kim ,  Su Han Kim ,  Myung Bong Yoo ,  Nam Boo Cho ,  Yi Sup Han

发明人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Byung Hun Kim ,  Su Han Kim ,  Myung Bong Yoo ,  Nam Boo Cho ,  Yi Sup Han

IPC分类号： B05D5/00 ,  C07F1/10 ,  C09D11/00 ,  C08K5/205 ,  C08K5/16 ,  B05D3/02 ,  B05D3/06

CPC分类号： C09D11/322 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/52 ,  B22F1/0018 ,  B22F9/30

摘要： The present invention relates to a process for preparation of silver complex compound and the compositions of silver ink containing the same. The present invention includes a) preparing silver complex compound with special structure by reacting silver compound with at least one or two mixtures selected from ammonium carbamate compound, ammonium carbonate compound or ammonium bicarbonate compound and b) preparing silver nano particles by reacting the silver complex compound with reducer or reducing or pyrolyzing the silver complex compound by applying heat thereto. The preparing method according to the present invention can prepare the silver nano practical with various shapes through a simple preparation process, improve the selectivity of the size of the silver complex compound, fire the silver complex compound even when it is fired at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity while facilitating the thickness control of the coating, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.

摘要翻译： 本发明涉及一种银络合物的制备方法和含有它们的银墨的组合物。 本发明包括：a）通过使银化合物与选自氨基甲酸铵化合物，碳酸铵化合物或碳酸氢铵化合物的至少一种或两种混合物反应制备具有特殊结构的银络合物，和b）通过使银络合物 通过对其进行加热而还原或还原或热解银络合物。 根据本发明的制备方法可以通过简单的制备方法制备各种形状的银纳米颗粒，提高银络合物的尺寸选择性，即使在低温下 在短时间内为150℃以下，提供能够形成涂层的油墨组合物或显示高导电性的精细图案，同时有利于涂层的厚度控制，并提供能够应用于反射膜的油墨组合物 材料，电磁波屏蔽和抗菌剂等

公开(公告)号：US08282860B2

公开(公告)日：2012-10-09

申请号：US12376893

申请日：2007-08-02

申请人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Byung Hun Kim ,  Su Han Kim ,  Myung Bong Yoo ,  Nam Boo Cho ,  Yi Sup Han

发明人： Kwang-Choon Chung ,  Hyun-Nam Cho ,  Byung Hun Kim ,  Su Han Kim ,  Myung Bong Yoo ,  Nam Boo Cho ,  Yi Sup Han

IPC分类号： H01B1/00

CPC分类号： C09D11/322 ,  B22F9/24 ,  B22F2998/00 ,  B82Y30/00 ,  C09D11/52 ,  B22F1/0018 ,  B22F9/30

摘要： The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.

摘要翻译： 本发明涉及一种制备银纳米颗粒的方法和含有该纳米颗粒的银墨的组合物。 本发明可以通过简单的制备方法制备具有各种形状的银纳米颗粒，提高银纳米颗粒尺寸的选择性，即使在短时间内在150℃或更低的低温下也能使银纳米颗粒发火，提供 能够形成涂层的油墨组合物或显示高导电性的精细图案，并且提供能够应用于反射膜材料，电磁波屏蔽和抗微生物剂等的油墨组合物。