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公开(公告)号:US09167735B2
公开(公告)日:2015-10-20
申请号:US13805843
申请日:2010-11-12
申请人: Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
发明人: Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
IPC分类号: H05K9/00
CPC分类号: H05K9/0088 , Y10T156/10
摘要: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
摘要翻译: 提供一种制造电磁干扰(EMI)屏蔽膜的方法,包括:(a)在第一保护膜上提供单个绝缘层,所述绝缘层由绝缘层组合物制成,所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; (b)在绝缘层上设置金属层; (c)在金属层上设置导电粘合剂层,导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和(d)在导电粘合剂层上提供第二保护膜,以及通过该方法制造的EMI屏蔽膜。
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公开(公告)号:US20130206315A1
公开(公告)日:2013-08-15
申请号:US13805843
申请日:2010-11-12
申请人: Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
发明人: Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
IPC分类号: H05K9/00
CPC分类号: H05K9/0088 , Y10T156/10
摘要: Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
摘要翻译: 提供一种制造电磁干扰(EMI)屏蔽膜的方法,包括:(a)在第一保护膜上提供单个绝缘层,所述绝缘层由绝缘层组合物制成,所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; (b)在绝缘层上设置金属层; (c)在金属层上设置导电粘合剂层,导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和(d)在导电粘合剂层上提供第二保护膜,以及通过该方法制造的EMI屏蔽膜。
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公开(公告)号:US09313900B2
公开(公告)日:2016-04-12
申请号:US13638716
申请日:2010-04-02
申请人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
CPC分类号: H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译: 公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板(PCB)的方法。 根据本发明的方法,可以形成精确且高导电性的电路图案,并且可以减少原材料和简化工艺。 此外,由于导电膏的印刷,即使导电层弯曲或暴露于热或物理冲击,也可以防止短路。
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公开(公告)号:US20130056250A1
公开(公告)日:2013-03-07
申请号:US13638716
申请日:2010-04-02
申请人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
发明人: Kwang Choon Chung , Young-Koo Han , Myung-Bong Yoo , Nam-Boo Cho , Young-Ho Han , Kyong-Min Lee , Kwang-Baek Yoon , Hee-Yong Ahn , Su-Han Kim
CPC分类号: H05K3/427 , H05K3/0094 , H05K3/06 , H05K3/105 , H05K3/12 , H05K3/246 , H05K2203/121 , Y10T29/49155
摘要: Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact.
摘要翻译: 公开了一种通过印刷导电浆料制造具有电路图案的双面印刷电路板(PCB)的方法。 根据本发明的方法,可以形成精确且高导电性的电路图案,并且可以减少原材料和简化工艺。 此外,由于导电膏的印刷,即使当导电层弯曲或暴露于热或物理冲击时也可以防止短路。
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公开(公告)号:US20100247798A1
公开(公告)日:2010-09-30
申请号:US12722689
申请日:2010-03-12
申请人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
发明人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
CPC分类号: C09D11/30 , C09D5/24 , C09D11/52 , Y10T428/12896
摘要: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
摘要翻译: 本发明涉及包含具有特殊结构的金属络合物和添加剂的各种导电油墨组合物及其制备方法,更具体地说涉及导电油墨组合物,其包含金属或金属化合物 与氨基甲酸铵或碳酸铵基化合物和添加剂及其制备方法。
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公开(公告)号:US07691294B2
公开(公告)日:2010-04-06
申请号:US11817374
申请日:2006-03-04
申请人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
发明人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
IPC分类号: H01B1/00
CPC分类号: C09D11/30 , C09D5/24 , C09D11/52 , Y10T428/12896
摘要: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
摘要翻译: 本发明涉及包含具有特殊结构的金属络合物和添加剂的各种导电油墨组合物及其制备方法,更具体地说涉及导电油墨组合物,其包含金属或金属化合物 与氨基甲酸铵或碳酸铵基化合物和添加剂及其制备方法。
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公开(公告)号:US20080206488A1
公开(公告)日:2008-08-28
申请号:US11817374
申请日:2006-03-04
申请人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
发明人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
CPC分类号: C09D11/30 , C09D5/24 , C09D11/52 , Y10T428/12896
摘要: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
摘要翻译: 本发明涉及包含具有特殊结构的金属络合物和添加剂的各种导电油墨组合物及其制备方法,更具体地说涉及导电油墨组合物,其包含金属或金属化合物 与氨基甲酸铵或碳酸铵基化合物和添加剂及其制备方法。
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公开(公告)号:US07955528B2
公开(公告)日:2011-06-07
申请号:US12722689
申请日:2010-03-12
申请人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
发明人: Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo , Nam-Boo Cho
IPC分类号: H01B1/00
CPC分类号: C09D11/30 , C09D5/24 , C09D11/52 , Y10T428/12896
摘要: The present invention relates to a variety of conductive ink compositions comprising a metal complex compound having a special structure and an additive and a method for preparing the same, more particularly to conductive ink compositions comprising a metal complex compound obtained by reacting a metal or metal compound with an ammonium carbamate- or ammonium carbonate-based compound and an additive and a method for preparing the same.
摘要翻译: 本发明涉及包含具有特殊结构的金属络合物和添加剂的各种导电油墨组合物及其制备方法,更具体地说涉及导电油墨组合物,其包含金属或金属化合物 与氨基甲酸铵或碳酸铵基化合物和添加剂及其制备方法。
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公开(公告)号:US08128211B2
公开(公告)日:2012-03-06
申请号:US12091496
申请日:2006-10-25
申请人: Kwang-Choon Chung , Chang-Soo Yu , Nam-Boo Cho , Young-Chul Shin , Bae-Song Heo
发明人: Kwang-Choon Chung , Chang-Soo Yu , Nam-Boo Cho , Young-Chul Shin , Bae-Song Heo
IPC分类号: B41J2/175
CPC分类号: B41J2/17556 , B41J2/09 , B41J2/17513 , B41J2/17596
摘要: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other side surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.
摘要翻译: 本发明涉及一种用于打印机的墨盒,包括在其上表面上形成有填充孔的主体; 主体内部的多个填充室由具有连接孔的隔板分隔开; 连接到填充室的排出室; 空气室,经由空气传输通道连接到所述填充室,以便向所述填充室供应空气; 安装在空气室中的吸气阀; 空气引导通道,引导到空气吸入阀的外部空气; 附着在身体的一个表面上的阻挡膜; 以及安装在所述主体的另一侧表面中的盖子; 以及形成在所述主体的外壁的表面中并与所述填充室连通的压力调节部。
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公开(公告)号:US20090073245A1
公开(公告)日:2009-03-19
申请号:US12091496
申请日:2006-10-25
申请人: Kwang-Choon Chung , Chang-Soo Yu , Nam-Boo Cho , Young-Chul Shin , Bae-Song Heo
发明人: Kwang-Choon Chung , Chang-Soo Yu , Nam-Boo Cho , Young-Chul Shin , Bae-Song Heo
IPC分类号: B41J2/175
CPC分类号: B41J2/17556 , B41J2/09 , B41J2/17513 , B41J2/17596
摘要: The present invention relates to an ink-cartridge for printers comprising a body formed having a filling hole on an upper surface thereof; a plurality of filling chambers inside of the body divided by a partition having a connecting hole; a discharging chamber connected to the filling chamber; an air chamber connected to the filling chamber via an air transferring channel so as to supply air to the filling chamber; an air suction valve installed in the air chamber; an air inducing channel inducing external air to the air suction valve; a blocking film attached to one surface of the body; and a cover installed in the other surface of the body; and a pressure regulating part formed in a surface of an outer wall of the body and communicating with the filling chamber.
摘要翻译: 本发明涉及一种用于打印机的墨盒,包括在其上表面上形成有填充孔的主体; 主体内部的多个填充室由具有连接孔的隔板分隔开; 连接到填充室的排出室; 空气室,经由空气传输通道连接到所述填充室,以便向所述填充室供应空气; 安装在空气室中的吸气阀; 空气引导通道,引导到空气吸入阀的外部空气; 附着在身体的一个表面上的阻挡膜; 以及安装在所述主体的另一个表面中的盖子; 以及形成在所述主体的外壁的表面中并与所述填充室连通的压力调节部。
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