公开(公告)号：US09167735B2

公开(公告)日：2015-10-20

申请号：US13805843

申请日：2010-11-12

申请人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

发明人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

IPC分类号： H05K9/00

CPC分类号： H05K9/0088 ,  Y10T156/10

摘要： Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

摘要翻译： 提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。

公开(公告)号：US20130206315A1

公开(公告)日：2013-08-15

申请号：US13805843

申请日：2010-11-12

申请人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

发明人： Kwang Choon Chung ,  Hyun Nam Cho ,  Myung Bong Yoo ,  Nam-Boo Cho ,  Seok Pil Jin ,  Seong Hoon No

IPC分类号： H05K9/00

CPC分类号： H05K9/0088 ,  Y10T156/10

摘要： Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.

摘要翻译： 提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料 树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。