公开(公告)号：US12020960B2

公开(公告)日：2024-06-25

申请号：US17045887

申请日：2019-04-08

Applicant: LAM RESEARCH CORPORATION

Inventor： Jeremy George Smith ,  Eric A. Pape

IPC: H01L21/67 ,  G05B17/02 ,  H01L21/687

CPC classification number: H01L21/67248 ,  G05B17/02 ,  H01L21/67109 ,  H01L21/68771

Abstract: A temperature controller for substrate processing system includes memory that stores a temperature control model that correlates a heat transfer gas pressure and a first temperature of a substrate support to a second temperature of a substrate arranged on the substrate support, a temperature calculation module configured to calculate the second temperature of the substrate using the heat transfer gas pressure, the first temperature of the substrate support, and the temperature control model, and a heat transfer gas control module configured to adjust the heat transfer gas pressure based on the second temperature of the substrate calculated by the temperature calculation module and a desired third temperature of the substrate.