公开(公告)号：US10748773B2

公开(公告)日：2020-08-18

申请号：US15577859

申请日：2017-06-22

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon Choi ,  Byung Rock Kim

IPC分类号： H01L21/268 ,  H01L21/52 ,  H01L21/677 ,  H01L23/00 ,  H01L21/60

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：US11813688B2

公开(公告)日：2023-11-14

申请号：US16921339

申请日：2020-07-06

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon Choi ,  Byung Rock Kim

IPC分类号： B23K3/08 ,  B23K1/005 ,  H01L21/268 ,  H01L21/52 ,  H01L21/677 ,  H01L23/00 ,  H05K13/04 ,  B23K26/08 ,  H01L21/60

CPC分类号： B23K1/0056 ,  B23K3/08 ,  B23K3/087 ,  B23K26/0823 ,  H01L21/268 ,  H01L21/52 ,  H01L21/6773 ,  H01L21/67721 ,  H01L24/04 ,  H01L24/741 ,  H01L24/75 ,  H01L24/81 ,  H05K13/0465 ,  H05K13/0469 ,  H01L2021/60112 ,  H01L2021/60292 ,  H01L2224/75261 ,  H01L2224/75651

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：US20200335344A1

公开(公告)日：2020-10-22

申请号：US16921339

申请日：2020-07-06

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon Choi ,  Byung Rock Kim

IPC分类号： H01L21/268 ,  H01L21/52 ,  H01L21/677 ,  H01L23/00

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：US11515287B2

公开(公告)日：2022-11-29

申请号：US17576464

申请日：2022-01-14

申请人： LASERSSEL CO., LTD.

发明人： Byung Rock Kim ,  Wan Ki Cho ,  Jae Joon Choi

IPC分类号： B23K1/00 ,  H01L23/00 ,  B23K1/005 ,  B23K3/06 ,  B23K3/08 ,  B23K101/40

摘要： The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.

公开(公告)号：US11257783B2

公开(公告)日：2022-02-22

申请号：US16305309

申请日：2017-06-09

申请人： LASERSSEL CO., LTD.

发明人： Byung Rock Kim ,  Wan Ki Cho ,  Jae Joon Choi

IPC分类号： B23K1/00 ,  B23K3/00 ,  H01L23/00 ,  B23K1/005 ,  B23K3/06 ,  B23K3/08 ,  B23K101/40

摘要： The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present invention provides a reel-to-reel layer reflow method comprising the steps of: a) transferring a substrate, which has been wound in a roll type, to one side while unwinding the same; b) forming a solder portion on the substrate; c) seating an emission target element on the solder portion and seating a non-emission target element on the substrate; d) surface-emitting a laser beam to the solder portion, on which the emission target element is seated, such that the emission target element is attached to the substrate; e) inspecting the substrate structure manufactured through said step d); and f) winding the substrate structure in a roll type.