公开(公告)号：US20160181447A1

公开(公告)日：2016-06-23

申请号：US14578334

申请日：2014-12-19

申请人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

发明人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

IPC分类号： H01L31/0224 ,  H01L31/18

CPC分类号： H01L31/022441 ,  B23K26/354 ,  B23K26/364 ,  H01L31/0745 ,  H01L31/182 ,  H01L2021/60292 ,  Y02E10/50

摘要： Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.

摘要翻译： 描述了太阳能电池的箔基金属化和所得到的太阳能电池的方法。 例如，制造太阳能电池的方法包括将金属箔定位在设置在基板中或上方的多个交替的N型和P型半导体区域上方。 该方法还涉及将金属箔激光焊接到交替的N型和P型半导体区域。 该方法还包括通过在与交替的N型和P型半导体区域之间的位置对准的区域处激光烧蚀金属箔的至少一部分来图案化金属箔。 激光焊接和图案化同时进行。

公开(公告)号：US12085518B2

公开(公告)日：2024-09-10

申请号：US18448766

申请日：2023-08-11

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Yu Wang ,  Hsi-Cheng Hsu

IPC分类号： G01N21/95 ,  H01L21/50 ,  H01L21/60 ,  H01L21/66

CPC分类号： G01N21/9505 ,  H01L21/50 ,  H01L22/12 ,  H01L2021/60112 ,  H01L2021/60292

摘要： Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.

公开(公告)号：US20230143539A1

公开(公告)日：2023-05-11

申请号：US17977137

申请日：2022-10-31

申请人： STMicroelectronics S.r.l.

发明人： Michele DERAI ,  Pierangelo MAGNI

IPC分类号： H01L23/48 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56 ,  H01L21/60 ,  H01L21/768

CPC分类号： H01L23/481 ,  H01L23/29 ,  H01L23/3135 ,  H01L23/49503 ,  H01L21/565 ,  H01L21/60 ,  H01L21/76877 ,  H01L2021/60292

摘要： A semiconductor die is arranged on a substrate and an encapsulation of laser direct structuring (LDS) material is molded onto the semiconductor die. A through mold via (TMV) extends through the encapsulation. This TMV includes a collar section that extends through a first portion of the encapsulation from an outer surface to an intermediate level of the encapsulation, and a frusto-conical section that extends from a bottom of the collar section through a second portion of the encapsulation. The collar section has a first cross-sectional area at the intermediate level. The first end of the frusto-conical section has a second cross-section area at the intermediate level. The second cross-sectional area is smaller than the first cross-sectional area. The TMV can have an aspect ratio which is not limited to 1:1.

公开(公告)号：US20230402355A1

公开(公告)日：2023-12-14

申请号：US18331215

申请日：2023-06-08

申请人： NEXPERIA B.V.

发明人： Wei Leong Tan ,  Wai Wai Lee ,  Hing Suan Cheam

IPC分类号： H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L25/065 ,  H01L21/52 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L23/4951 ,  H01L23/3675 ,  H01L23/3121 ,  H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L2225/06506 ,  H01L2021/60292

摘要： An electronic package and a method for manufacturing the same is provided. The electronic package includes a first substrate, an electronic component arranged on and/or formed in the first substrate, a thermally conductive second substrate including a first portion and a second portion integrally connected to the first portion, and at least the first portion among the first and second portion is fixedly attached to the electronic component, and a package material arranged to encapsulate the electronic component and to at least partially encapsulate the first and second substrate, and the package material includes a recess formed therein that extends up to a surface of the first portion.

公开(公告)号：US11815471B2

公开(公告)日：2023-11-14

申请号：US17878428

申请日：2022-08-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chih-Yu Wang ,  Hsi-Cheng Hsu

IPC分类号： G01N21/95 ,  H01L21/50 ,  H01L21/66 ,  H01L21/60

CPC分类号： G01N21/9505 ,  H01L21/50 ,  H01L22/12 ,  H01L2021/60112 ,  H01L2021/60292

摘要： Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.

公开(公告)号：US11813688B2

公开(公告)日：2023-11-14

申请号：US16921339

申请日：2020-07-06

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon Choi ,  Byung Rock Kim

IPC分类号： B23K3/08 ,  B23K1/005 ,  H01L21/268 ,  H01L21/52 ,  H01L21/677 ,  H01L23/00 ,  H05K13/04 ,  B23K26/08 ,  H01L21/60

CPC分类号： B23K1/0056 ,  B23K3/08 ,  B23K3/087 ,  B23K26/0823 ,  H01L21/268 ,  H01L21/52 ,  H01L21/6773 ,  H01L21/67721 ,  H01L24/04 ,  H01L24/741 ,  H01L24/75 ,  H01L24/81 ,  H05K13/0465 ,  H05K13/0469 ,  H01L2021/60112 ,  H01L2021/60292 ,  H01L2224/75261 ,  H01L2224/75651

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：US20170179312A1

公开(公告)日：2017-06-22

申请号：US15454890

申请日：2017-03-09

申请人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

发明人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

IPC分类号： H01L31/0224 ,  H01L31/0745

CPC分类号： H01L31/022441 ,  B23K26/354 ,  B23K26/364 ,  H01L31/0516 ,  H01L31/0745 ,  H01L31/182 ,  H01L2021/60292 ,  Y02E10/50

摘要： Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.

公开(公告)号：US20240033840A1

公开(公告)日：2024-02-01

申请号：US18377450

申请日：2023-10-06

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon CHOI ,  Byung Rock KIM

IPC分类号： B23K1/005 ,  H01L21/268 ,  H01L21/52 ,  H01L21/677 ,  H01L23/00 ,  H05K13/04 ,  B23K3/08 ,  B23K26/08 ,  B23K35/02

CPC分类号： B23K1/0056 ,  H01L21/268 ,  H01L21/52 ,  H01L21/67721 ,  H01L21/6773 ,  H01L24/741 ,  H01L24/75 ,  H01L24/04 ,  H01L24/81 ,  H05K13/0465 ,  H05K13/0469 ,  B23K3/087 ,  B23K26/0823 ,  B23K35/025 ,  H01L2021/60292

摘要： Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

公开(公告)号：US11817512B2

公开(公告)日：2023-11-14

申请号：US17751446

申请日：2022-05-23

申请人： Maxeon Solar Pte. Ltd.

发明人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Périne Jaffrennou

IPC分类号： H01L31/0224 ,  H01L31/18 ,  B23K26/364 ,  B23K26/354 ,  H01L31/05 ,  H01L31/0745 ,  H01L21/60

CPC分类号： H01L31/022441 ,  B23K26/354 ,  B23K26/364 ,  H01L31/0516 ,  H01L31/0745 ,  H01L31/182 ,  H01L2021/60292 ,  Y02E10/50

摘要： Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.

公开(公告)号：US09620661B2

公开(公告)日：2017-04-11

申请号：US14578334

申请日：2014-12-19

申请人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

发明人： Taeseok Kim ,  Gabriel Harley ,  John Wade Viatella ,  Perine Jaffrennou

IPC分类号： H01L31/0224 ,  H01L31/0745

CPC分类号： H01L31/022441 ,  B23K26/354 ,  B23K26/364 ,  H01L31/0745 ,  H01L31/182 ,  H01L2021/60292 ,  Y02E10/50

摘要： Approaches for foil-based metallization of solar cells and the resulting solar cells are described. For example, a method of fabricating a solar cell involves locating a metal foil above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate. The method also involves laser welding the metal foil to the alternating N-type and P-type semiconductor regions. The method also involves patterning the metal foil by laser ablating through at least a portion of the metal foil at regions in alignment with locations between the alternating N-type and P-type semiconductor regions. The laser welding and the patterning are performed at the same time.