公开(公告)号：US20180037089A1

公开(公告)日：2018-02-08

申请号：US15445753

申请日：2017-02-28

Applicant: LG ELECTRONICS INC.

Inventor： Jaehyun BAEK ,  Jaehun SHIM ,  Hyunwoo KIM ,  Hyounjeong SHIN

IPC: B60H1/22 ,  B60H1/32 ,  B60H1/00 ,  F24H1/12 ,  H05B3/26

CPC classification number: B60H1/2221 ,  B60H1/00392 ,  B60H1/3204 ,  B60H2001/2271 ,  F24H1/121 ,  H05B3/265 ,  H05B2203/016 ,  H05B2203/021

Abstract: A heating module includes: an insulating case; at least one heat emitting element that is supported by the insulating case; at least one terminal plate that is arranged in the insulating case to contact the heat emitting element; and a ceramic insulator that is arranged on an outer surface of the terminal plate.