公开(公告)号：US20220018796A1

公开(公告)日：2022-01-20

申请号：US17295750

申请日：2019-12-06

Applicant: LG ELECTRONICS INC.

Inventor： Myungwon LEE ,  Daehyun PARK ,  Hyunchul KIM ,  Soonyoung MIN

IPC: G01N27/22 ,  H01Q7/00 ,  H01Q1/38 ,  H05K1/16 ,  H05K1/09 ,  G01N33/02

Abstract: The present invention provides a sensor comprising: a substrate; an antenna pattern formed in a spiral shape on the substrate; first and second electrodes formed on the substrate and spaced apart from each other in parallel; a circuit wiring formed to be connected to each of the first and second electrodes; and an element bonded to the antenna pattern and the circuit wiring, wherein cross sections of the first and second electrodes have a curvature.

公开(公告)号：US20250099975A1

公开(公告)日：2025-03-27

申请号：US18832486

申请日：2023-08-09

Applicant: LG ELECTRONICS INC. ,  ENERGY MATERIALS CORP.

Inventor： Wonsuk LEE ,  Inyoung SHIM ,  Yohwan MOON ,  Heejeong NAM ,  Seunggun LEE ,  Geonwoo KIM ,  Jongil KIM ,  Myungwon LEE ,  Jaehong SON ,  Senghyen SONG ,  Jiho KIM

IPC: B02C23/40 ,  B02C23/20 ,  C22B1/248 ,  H01M10/54

Abstract: The present specification relates to an embodiment of a battery shredding system and a battery shredding method that cools an object with a coolant in response to a state condition of the object, shreds the cooled material into flake shapes, and mixes or combines the shredded material with a stabilizer in response to the state condition.

公开(公告)号：US20230035406A1

公开(公告)日：2023-02-02

申请号：US17790350

申请日：2019-12-31

Applicant: LG ELECTRONICS INC.

Inventor： Hyunchul KIM ,  Hosik KANG ,  Myungwon LEE ,  Soonyoung MIN

IPC: G01N21/59

Abstract: The present disclosure provides a turbidity sensor comprising: a light irradiation unit which emits light toward a medium; a light receiving unit which receives light having passed through the medium; a memory which contains a correction value corresponding to a signal received by the light receiving unit; and a processor which corrects the signal received by the light receiving unit by using the correction value and calculates the turbidity of the medium by using the corrected signal.

公开(公告)号：US20170110781A1

公开(公告)日：2017-04-20

申请号：US15285253

申请日：2016-10-04

Applicant: LG ELECTRONICS INC.

Inventor： Myungwon LEE ,  Hyunchul KIM ,  Daehyun PARK ,  Sanggyu KIM ,  Seungyeon SONG ,  Hongyoon JUNG

IPC: H01Q1/22 ,  G01N33/03 ,  G01N27/04 ,  H01Q7/00 ,  H02J50/10

CPC classification number: G01N33/03 ,  G01N27/02 ,  G01N27/04 ,  H01Q1/2225 ,  H01Q7/00 ,  H02J7/025 ,  H02J50/10 ,  H04B5/0037

Abstract: A sensor according to the present disclosure may include a substrate, an antenna pattern formed to transmit and receive a wireless signal to and from an external device, a sensing unit configured to be driven when the wireless signal is received through the antenna pattern and to generate a signal when in contact with a sensing target material, and a circuit line electrically connected between the antenna pattern and the sensing unit, wherein the antenna pattern and the circuit line are formed of a same material and on a same layer. A fabrication method of a sensor according to the present disclosure may include printing a conductive layer having an antenna pattern, a sensing electrode and a circuit line on one surface of a substrate with a single layer, heat-drying the conductive layer, printing, on a single layer, a circuit insulating layer that covers part of the circuit line and an antenna insulating layer that covers part of the antenna pattern, curing the insulating layer, printing an antenna bridge on the antenna insulating layer, heat-drying the antenna bridge, and bonding a device electrically connected to the circuit line to the substrate.

公开(公告)号：US20190331623A1

公开(公告)日：2019-10-31

申请号：US16473212

申请日：2017-12-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunchul KIM ,  Myungwon LEE

IPC: G01N27/12 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q1/36 ,  B41F15/06 ,  B41F13/11

Abstract: Provided is a sensor comprising a non-conductive substrate; and a conductive layer electronically printed on one side of the substrate, wherein the conductive layer comprises: an antenna pattern for transmitting and receiving a radio signal with an external device; a sensing electrode connected to the antenna pattern via a circular wiring for sensing an impedance change due to contact with a sensing target material; and a coating electrode stacked on the sensing electrode for removing an occurrence of noise of the impedance change. Accordingly, the present invention solves the problem of a sensor, in the form of a terminal, not being compact and the problem of high manufacturing costs and low manufacturing quality of a sensor manufactured using a deposition method in order to replace such sensor with a sensor manufactured by a printing method, and solves a corrosion problem of a sensing electrode, a durability problem, etc. that may occur in the sensor of the printing method.