公开(公告)号：US20210280498A1

公开(公告)日：2021-09-09

申请号：US17258993

申请日：2018-07-09

Applicant: LG Electronics Inc.

Inventor： Myeon Gyu KANG ,  Yong Sik KIM ,  Namjoon CHO

IPC: H01L23/473 ,  H01L23/367 ,  H01L25/07 ,  H01L25/11 ,  H05K7/20

Abstract: The present invention is a cooling apparatus, and a cooling apparatus according to one embodiment of the present invention comprises: cooling jackets, each comprising a main body and a plurality of cooling fins, the main body comprising an upper plate and a lower plate that is joined to the upper plate, and providing a coolant flow channel via the internal space between the upper and lower plates, and the plurality of cooling fins being are arranged inside the main bodies, along the coolant flow channels, so as to be spaced apart from one-another by a set distance, and being connected between the upper and lower plates; and a plurality of double-sided chip modules which are disposed between at least two cooling jackets, with the upper and lower surfaces of the double-sided chip modules contacting the cooling jackets, wherein the plurality of double-sided chip modules are disposed spaced apart from one-another in correspondence with the locations of the cooling fins and positioned so as to be able to face one-another, and thus the upper and lower surfaces can be simultaneously cooled.

公开(公告)号：US20210144879A1

公开(公告)日：2021-05-13

申请号：US17259071

申请日：2018-07-09

Applicant: LG Electronics Inc.

Inventor： Myeon Gyu KANG ,  Yong Sik KIM ,  Namjoon CHO

IPC: H05K7/20 ,  F28F9/02 ,  F28F9/013

Abstract: The present invention is a cooling apparatus, and a cooling apparatus according to one embodiment of the present invention comprises: a cooling unit comprising a tube main body formed by extrusion such that a coolant channel through which a coolant flows is formed there-through, and headers which are connected to the respective ends of the tube main body and, when a plurality of the tube main bodies are stacked, a plurality of the headers can be assembled in the vertical direction so as to connect the coolant channels of each of the tube main bodies; double-sided chip modules which are disposed between cooling units such that both surfaces of the double-sided chip modules are able to contact the cooling units; and a heat-radiating adhesion unit which attaches the double-sided chip modules to the tube main bodies, wherein the headers are assembled so as to be in close contact, in the vertical direction, ensuring a set spacing between the tube main bodies and the double-sided chip modules, the set spacing being not greater than the thickness of the heat-radiating adhesion unit.