公开(公告)号：US20160204329A1

公开(公告)日：2016-07-14

申请号：US14913220

申请日：2014-08-20

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang CHO ,  Sang Gon KIM ,  Sook Hyun KIM ,  Chae Hoon KIM ,  Myoung Lae ROH ,  Jong Bae SHIN ,  Boone WON ,  Jong Min LEE

IPC: H01L35/32

CPC classification number: H01L35/325 ,  H01L35/30 ,  H01L35/32

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract translation: 本发明的实施例涉及一种用于冷却的热电元件和热电模块，并且通过具有不同表面积的第一基板和第二基板来使热电模块变薄，以提高散热效果。

公开(公告)号：US20180198049A1

公开(公告)日：2018-07-12

申请号：US15914116

申请日：2018-03-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang CHO ,  Sang Gon KIM ,  Sook Hyun KIM ,  Chae Hoon KIM ,  Myoung Lae ROH ,  Jong Bae SHIN ,  Boone WON ,  Jong Min LEE

IPC: H01L35/32 ,  H01L35/30

CPC classification number: H01L35/325 ,  H01L35/30 ,  H01L35/32

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US20150214456A1

公开(公告)日：2015-07-30

申请号：US14607217

申请日：2015-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Gon KIM ,  Sook Hyun Kim ,  Jong Bae Shin ,  Boone Won ,  Yong Sang Cho ,  Hyung Eui Lee

IPC: H01L35/16 ,  H01L35/22 ,  H01L35/18

CPC classification number: H01L35/16 ,  C22C1/0483 ,  C22C32/0015 ,  C22C32/0089 ,  H01L35/00 ,  H01L35/18 ,  H01L35/22

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract translation: 提供了包括金属氧化物粉末和热电粉末的热电材料。 因此，内部填充率提高，从而可以根据导电率和塞贝克系数的增加以及热导率的降低来最大化珀尔帖效应，从而能够提高热电元件的品质因数（ZT） 。

公开(公告)号：US20190259930A1

公开(公告)日：2019-08-22

申请号：US16402582

申请日：2019-05-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Sang CHO ,  Sang Gon KIM ,  Sook Hyun KIM ,  Chae Hoon KIM ,  Myoung Lae ROH ,  Jong Bae SHIN ,  Boone WON ,  Jong Min LEE

IPC: H01L35/32 ,  H01L35/30

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

公开(公告)号：US20150204585A1

公开(公告)日：2015-07-23

申请号：US14602389

申请日：2015-01-22

Applicant: LG INNOTEK CO., LTD.

Inventor： Boone WON ,  Sang Gon KIM

IPC: F25B21/02 ,  H01L35/30

CPC classification number: F25B21/02 ,  H01L35/30 ,  H01L35/32

Abstract: Provided is a thermoelectric module, including: a first substrate and a second substrate disposed to face each other; at least one unit thermoelectric element composed of a pair of semiconductor elements including a P-type semiconductor element and an N-type semiconductor element disposed in an internal area between the first substrate and the second substrate disposed to face each other and having respective ends electrically connected to each other via electrodes; and at least two kinds of sealing parts having different thermal conductivities and coated on at least one area of the internal area between the first substrate and the second substrate disposed to face each other.

Abstract translation: 提供了一种热电模块，包括：第一基板和第二基板，彼此相对设置; 至少一个单元热电元件，由包括P型半导体元件和N型半导体元件的一对半导体元件组成，所述P型半导体元件和N型半导体元件设置在第一基板和第二基板之间的内部区域中， 通过电极相互连接; 以及具有不同热导率的至少两种密封部件，并且涂覆在第一基板和第二基板之间的内部区域的至少一个区域上以彼此面对。