-
公开(公告)号:US20220384701A1
公开(公告)日:2022-12-01
申请号:US17755820
申请日:2020-11-02
Applicant: LG INNOTEK CO., LTD.
Inventor: Myoung Lae ROH , Seung Yong LEE , Hyung Eui LEE
Abstract: A power-generating apparatus according to an embodiment of the present invention comprises: a housing in which a fluid flows along the interior thereof and at least a portion of the wall surface thereof includes a flat surface formed of metal; a thermoelectric module disposed on the flat surface of the housing; and an insulating member disposed on the flat surface of the housing so as to be beside the thermoelectric module.
-
公开(公告)号:US20240008366A1
公开(公告)日:2024-01-04
申请号:US18251434
申请日:2021-11-03
Applicant: LG INNOTEK CO., LTD.
Inventor: Seung Yong LEE , Myoung Lae ROH , Un Hak LEE
Abstract: An embodiment of the present invention provides a heat conversion device comprising: a frame comprising a plurality of second through holes; and one or more thermoelectric devices connected to the frame, wherein the width of each of the plurality of second through holes is smaller than the distance between through holes which are closest to each other from among the plurality of second through holes.
-
公开(公告)号:US20210135079A1
公开(公告)日:2021-05-06
申请号:US16477235
申请日:2018-01-24
Applicant: LG INNOTEK CO., LTD.
Inventor: Seung Yong LEE , Chang Eun KIM , Jin Suk LEE
Abstract: A thermoelectric sintered body according to an embodiment comprises thermoelectric powder, the thermoelectric powder, arranged in a horizontal direction, comprising: a plurality of first powders in the shape of plate-type flakes; and a plurality of second powders in a shape different from that of the first powders, wherein the second powders comprise 5 volume % or less of the total thermoelectric powder.
-
公开(公告)号:US20220320405A1
公开(公告)日:2022-10-06
申请号:US17633638
申请日:2020-08-04
Applicant: LG INNOTEK CO., LTD.
Inventor: Jeung Ook PARK , Seung Yong LEE , Seok Min JIN
Abstract: A thermoelectric apparatus according to one exemplary embodiment of the present invention includes a heat dissipation member having a groove formed therein, a first electrode disposed in the groove, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, a substrate disposed on the second electrode, and a sealing member disposed between a sidewall of the groove and the substrate.
-
公开(公告)号:US20230354708A1
公开(公告)日:2023-11-02
申请号:US18041417
申请日:2021-08-11
Applicant: LG INNOTEK CO., LTD.
Inventor: Sue Kyung OH , Myoung Lae ROH , Seung Yong LEE
Abstract: Disclosed according to an embodiment is a thermoelectric module comprising: a first heat-conducting member including a first recess; a second heat-conducting member spaced apart from the first heat-conducting member; a thermoelectric element disposed between the first heat-conducting member and the second heat-conducting member; and a circuit unit electrically connected to the thermoelectric element to control resistance, wherein the circuit unit is disposed in the first recess.
-
-
-
-