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公开(公告)号：US20220246445A1
公开(公告)日：2022-08-04
申请号：US17660161
申请日：2022-04-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Oh CHO , Yoon Tai KIM
IPC: H01L21/48 , H01L23/498
Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
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公开(公告)号：US20160004340A1
公开(公告)日：2016-01-07
申请号：US14788836
申请日：2015-07-01
Applicant: LG INNOTEK CO., LTD.
Inventor： Yoon Tai KIM , Hyung Mook OH , Kweon Jin LEE , Soo Hong KIM
IPC: G06F3/041
CPC classification number: G06F3/041 , G06F3/044 , G06F2203/04103 , G06F2203/04112
Abstract: A touch window includes a substrate, and an electrode part on the substrate. The sensing electrode includes a base substrate formed with a pattern part, and an electrode layer on the pattern part, where the electrode layer has a thickness in a range of 0.03 μm to 3 μm.
Abstract translation: 触摸窗包括基板和基板上的电极部分。 感测电极包括形成有图案部分的基底基板和图案部分上的电极层，其中电极层的厚度在0.03μm至3μm的范围内。
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公开(公告)号：US20220090270A1
公开(公告)日：2022-03-24
申请号：US17542043
申请日：2021-12-03
Applicant: LG INNOTEK CO., LTD.
Inventor： Jee Heum PAIK , Yoon Tai KIM
Abstract: Discussed is a deposition mask including a metal plate having a first surface and a second surface opposite to the first surface, wherein the metal plate including an invar, wherein the metal plate includes a plurality of through-hole, wherein the through-hole includes a first surface hole forming in the first surface, a second surface hole forming in the second surface, and a connecting part through which the first surface hole and the second surface hole communicate with each other, and wherein an angle formed by a virtual line connecting the end of the connecting part and the end of the second surface hole, and a virtual line extending in a direction parallel to the second face from the end of the second surface hole is 30 to 60 degrees.
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Patent Agency Ranking
公开(公告)号：US20200328093A1
公开(公告)日：2020-10-15
申请号：US16910959
申请日：2020-06-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Oh CHO , Yoon Tai KIM
IPC: H01L21/48 , H01L23/498
Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
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公开(公告)号：US20210140061A1
公开(公告)日：2021-05-13
申请号：US16492535
申请日：2018-03-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Jee Heum PAIK , Yoon Tai KIM
Abstract: A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30 μm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion. The multilayer metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate containing an alloy of nickel (Ni) and iron (Fe), and is manufactured by a method comprising the steps of: forming a nickel-plated layer; forming an iron-plated layer on the nickel-plated layer; forming a multilayer-plated plate in which the nickel-plated layer and the iron-plated layer are alternately and repeatedly arranged; and heat-treating the multilayer-plated plate at a temperature of 300° C. or higher.
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公开(公告)号：US20210090902A1
公开(公告)日：2021-03-25
申请号：US16952782
申请日：2020-11-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Oh CHO , Yoon Tai KIM
IPC: H01L21/48 , H01L23/498
Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
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公开(公告)号：US20230383414A1
公开(公告)日：2023-11-30
申请号：US18234270
申请日：2023-08-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Jee Heum PAIK , Yoon Tai KIM
CPC classification number: C23F1/28 , B32B15/015 , C23C14/042 , C23F1/02 , C25D5/50 , C25D7/0614 , C25D5/12 , C23C14/12
Abstract: Discussed is a deposition mask including a metal plate. The metal plate includes an alloy of nickel (Ni) and iron (Fe) having a plurality of through-holes. Each of the through-holes includes a first surface hole, a second surface hole opposite to the first surface hole, and a connecting part through which the first surface hole and the second surface hole communicate with each other. The metal plate includes a first outer portion, a second outer portion opposite to the first outer portion and a central portion between the first outer portion and the second outer portion. Nickel contents of the first outer portion and the second outer portion are greater than that of the central portion.
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公开(公告)号：US20200126811A1
公开(公告)日：2020-04-23
申请号：US16662583
申请日：2019-10-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Oh CHO , Yoon Tai KIM
IPC: H01L21/48 , H01L23/498
Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
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