公开(公告)号：US12119169B1

公开(公告)日：2024-10-15

申请号：US18748188

申请日：2024-06-20

申请人： Shenzhen Topsun Technology Co., Ltd.

发明人： Lin Tian ,  Weifeng Wu

IPC分类号： H01F41/02 ,  B22F3/14 ,  B22F3/24 ,  B22F7/08 ,  H01F41/04 ,  C25D5/12

CPC分类号： H01F41/0246 ,  B22F3/14 ,  B22F3/24 ,  B22F7/08 ,  H01F41/04 ,  B22F2003/242 ,  B22F2003/248 ,  B22F2998/10 ,  C25D5/12

摘要： Disclosed is a hot press molding method for an inductor, including: S1: manufacturing an inductance coil, a first magnetic powder block and a second magnetic powder block; the inductance coil being in a U shape, and one side of the first magnetic powder block being provided with an embedding groove; S2: placing the inductance coil into the embedding groove; pins of the inductance coil being located outside the embedding groove; S3: placing the second magnetic powder block into the inductance coil; the second magnetic powder block being simultaneously attached to inner walls of the inductance coil and the embedding groove; S4: hot-pressing the inductance coil, the first magnetic powder block and the second magnetic powder block by a hot pressing mold.

公开(公告)号：US12104271B2

公开(公告)日：2024-10-01

申请号：US18215740

申请日：2023-06-28

申请人： TOYO KOHAN CO., LTD.

发明人： Hiroki Yanaga ,  Shinichirou Horie ,  Etsuro Tsutsumi ,  Masashi Ichishima ,  Toshifumi Koyanagi ,  Koh Yoshioka

IPC分类号： C25D5/16 ,  B32B15/01 ,  C25D5/12

CPC分类号： C25D5/16 ,  B32B15/013 ,  B32B15/017 ,  C25D5/12 ,  B32B2307/538

摘要： A roughened plated sheet including a roughened plated layer having a roughened nickel plated layer and a zinc plated layer formed on at least one surface of a metal substrate in this order from the metal substrate side, wherein a ten-point average roughness Rzjis of a surface of the roughened plated layer, according to laser microscope measurement, is 3 μm or more, and the metal substrate is a steel sheet.

公开(公告)号：US20240287699A1

公开(公告)日：2024-08-29

申请号：US18563521

申请日：2022-03-17

申请人： DOWA METALTECH CO., LTD.

发明人： Hirotaka KOTANI ,  Hiroto NARIEDA ,  Takao TOMIYA ,  Tatsuhiro DOI ,  Yukiya KATO ,  Hirotaka TAKAHASHI

IPC分类号： C25D5/48 ,  C25D5/12 ,  C25D7/00 ,  C25D15/00

CPC分类号： C25D5/48 ,  C25D5/12 ,  C25D7/00 ,  C25D15/00

摘要： There is provided a composite material in which an oxygen-containing silver-based coating layer is formed on a base material. the oxygen-containing silver-based coating layer containing silver and having oxygen present in the vicinity of its surface. and the base material comprising copper or copper alloy.

公开(公告)号：US20240287698A1

公开(公告)日：2024-08-29

申请号：US18573503

申请日：2022-06-30

申请人： Umicore Galvanotechnik GmbH

发明人： Robert Ziebart ,  Guenter Wirth ,  Silvia Neuhaus ,  Stefan Mueller

IPC分类号： C25D3/58 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C30/02 ,  C22C30/04 ,  C22C30/06 ,  C25D5/10 ,  C25D5/12 ,  G06K19/077

CPC分类号： C25D3/58 ,  B32B15/01 ,  C22C9/02 ,  C22C9/04 ,  C22C13/00 ,  C22C30/02 ,  C22C30/04 ,  C22C30/06 ,  C25D5/10 ,  C25D5/12 ,  G06K19/07722

摘要： The invention is directed to the use of electrolytic bronze deposits as substitutes for the noble metal electroplating of electronic circuits, e.g. for use in electronic payment cards and identity cards. The invention also relates to a novel layer sequence of bronze layers.

公开(公告)号：US20240229244A9

公开(公告)日：2024-07-11

申请号：US17971898

申请日：2022-10-24

申请人： General Electric Company

发明人： Bangalore Aswatha Nagaraj ,  Liming Zhang

IPC分类号： C23C28/02 ,  B32B15/01 ,  C23C10/08 ,  C23C10/60 ,  C25D3/12 ,  C25D3/50 ,  C25D5/12 ,  C25D5/50

CPC分类号： C23C28/022 ,  B32B15/017 ,  C23C10/08 ,  C23C10/60 ,  C25D3/12 ,  C25D3/50 ,  C25D5/12 ,  C25D5/50

摘要： Methods of forming a coating system on a surface of a cobalt-based superalloy component are provided. The method includes forming a nickel-based primer layer on the surface of the cobalt-based superalloy component; forming an intermediate nickel-containing layer on the nickel-based primer layer; and heat treating the cobalt-based superalloy component to form a diffusion coating on the surface of the cobalt-based superalloy component. The intermediate nickel-containing layer includes nickel, chromium, and aluminum. Coated cobalt-based superalloy components formed from such a method are also provided.

公开(公告)号：US12018710B2

公开(公告)日：2024-06-25

申请号：US17272043

申请日：2019-08-27

申请人： Hitachi Automotive Systems, Ltd.

发明人： Kenta Yakuzawa ,  Toshikazu Shigyo

IPC分类号： F16B5/00 ,  C25D5/12 ,  F16B5/02 ,  F16J15/14 ,  H05K5/06

CPC分类号： F16B5/02 ,  C25D5/12 ,  F16J15/14 ,  H05K5/06 ,  H05K2201/0999

摘要： An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole. The sealing material 28 has penetrated into the exposed portion 25a of the base material.

公开(公告)号：US20240153678A1

公开(公告)日：2024-05-09

申请号：US17769311

申请日：2020-09-24

申请人： KOA CORPORATION

发明人： Yasushi AKAHANE ,  Nobuhiko TAMADA

IPC分类号： H01C17/00 ,  C25D3/56 ,  C25D5/12 ,  C25D7/06 ,  C25D21/12 ,  H01C1/032 ,  H01C1/142 ,  H01C17/242

CPC分类号： H01C17/006 ,  C25D3/562 ,  C25D5/12 ,  C25D7/0642 ,  C25D21/12 ,  H01C1/032 ,  H01C1/142 ,  H01C17/242

摘要： A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

公开(公告)号：US11952675B2

公开(公告)日：2024-04-09

申请号：US17787847

申请日：2020-11-10

申请人： NIPPON DENKAI, LTD.

发明人： Toshio Kawasaki ,  Yasuhiro Endo

IPC分类号： C25D5/12 ,  C23C28/00 ,  C25D5/00 ,  C25D5/16 ,  C25D5/48 ,  C25D7/06 ,  H05K1/09 ,  H05K3/38

CPC分类号： C25D5/12 ,  C23C28/30 ,  C25D5/16 ,  C25D5/48 ,  C25D5/605 ,  C25D7/0614 ,  H05K1/09 ,  H05K3/384 ,  Y10T428/12438

摘要： Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/μm2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 μm. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

公开(公告)号：US20240084472A1

公开(公告)日：2024-03-14

申请号：US18263655

申请日：2021-02-05

申请人： Heraeus Materials Singapore Pte. Ltd. ,  Heraeus Deutschland GmbH & Co. KG

发明人： Murali SARANGAPANI ,  Yee Weon LIM ,  Wai Khee SEE THO ,  Mariyappan DHAYALAN ,  Chee Chow TAN ,  Juergen SCHARF ,  Sungsig KANG

IPC分类号： C25D5/12 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/16 ,  C25D5/50 ,  C25D7/06

CPC分类号： C25D5/12 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/16 ,  C25D5/50 ,  C25D7/0607

摘要： A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core itself is a silver-based wire core, wherein the coating layer is a double-layer comprised of a 1 to 100 nm thick inner layer of nickel or palladium and an adjacent 1 to 250 nm thick outer layer of gold, characterized in that the wire exhibits a total carbon content of ≤40 wt.-ppm.

公开(公告)号：US20240079298A1

公开(公告)日：2024-03-07

申请号：US18458668

申请日：2023-08-30

申请人： Mitsui High-tec, Inc.

发明人： Kento KOGA ,  Shintaro SUGYO ,  Tomokatsu KUNITAKE

IPC分类号： H01L23/495 ,  C25D5/12 ,  H01L23/00

CPC分类号： H01L23/49582 ,  C25D5/12 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/014

摘要： Provided is a metal component used for manufacturing a semiconductor device, the metal component including: a substrate having a conductivity; a nickel layer formed on a portion of a surface of the substrate and containing nickel as a main component; and a noble metal layer formed on a surface of the nickel layer.