公开(公告)号：US20200328093A1

公开(公告)日：2020-10-15

申请号：US16910959

申请日：2020-06-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh CHO ,  Yoon Tai KIM

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US20220246445A1

公开(公告)日：2022-08-04

申请号：US17660161

申请日：2022-04-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh CHO ,  Yoon Tai KIM

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US20210090902A1

公开(公告)日：2021-03-25

申请号：US16952782

申请日：2020-11-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh CHO ,  Yoon Tai KIM

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US20200126811A1

公开(公告)日：2020-04-23

申请号：US16662583

申请日：2019-10-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh CHO ,  Yoon Tai KIM

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US20180101258A1

公开(公告)日：2018-04-12

申请号：US15568352

申请日：2016-04-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh CHO ,  Seong Il KWEON ,  Dong Keon LEE ,  Wong Sic KIM ,  Ja Ram KIM ,  Dong Mug SEONG ,  Suk Yong LEE

IPC: G06F3/044 ,  G06F3/047

CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F3/047 ,  G06F2203/04112

Abstract: A touch window according to an embodiment comprises: a substrate; a sensing electrode arranged on the substrate; and a reflection prevention layer arranged on the sensing electrode, wherein the reflection prevention layer comprises a first sub reflection prevention layer arranged on a first surface of the sensing electrode, a third sub reflection prevention layer arranged on a second surface, which lies opposite the first surface, and second sub reflection prevention layers arranged on both side surfaces, which connect the first and second surfaces, respectively. In addition, a touch window according to an embodiment comprises: a substrate; a base member comprising a pattern portion arranged on the substrate; a sensing electrode arranged inside the pattern portion; and a reflection prevention layer surrounding the sensing electrode, wherein the reflection prevention layer comprises a first sub reflection prevention layer arranged on the lower surface of the sensing electrode, second sub reflection prevention layers arranged on both side surfaces of the sensing electrode, and a third sub reflection prevention layer arranged on the upper surface of the sensing electrode, and the second sub reflection prevention layers comprise inclined surfaces, respectively. In addition, a touch window according to an embodiment comprises: a substrate; a sensing electrode on the substrate; a first sub reflection prevention layer arranged on a first surface of the sensing electrode; and a third sub reflection prevention layer arranged on a second surface of the sensing electrode, wherein at least one of the sensing electrode, the first sub reflection prevention layer, and the third sub reflection prevention layer has a side surface inclined at an acute angle of inclination with regard to a surface of the substrate.