公开(公告)号：US20130133938A1

公开(公告)日：2013-05-30

申请号：US13665972

申请日：2012-11-01

Applicant: LINTEC Corporation

Inventor： Yosuke SATO ,  Michio KANAI ,  Hayato NAKANISHI

IPC: H01L21/683 ,  H05K1/02 ,  H05K1/11 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68381 ,  H05K1/02 ,  H05K1/115 ,  Y10T428/24942

Abstract: A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 μm. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G′ at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 μm and a diameter of 15 μm at a pitch of 40 μm having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 μm or less of the electrode.

Abstract translation: 切割片包括基部，基部的一个面上的中间层和设置在中间层上并具有8至30μm厚度的压敏粘合剂层。 压敏粘合剂层包括分子中具有能量射线固化性双键的化合物，固化前的压敏粘合剂层的23℃下的储存弹性G'大于23℃时的储存弹性的4倍 C.中间层C. 当切割片通过粘合片层叠在形成有具有15μm的高度的圆柱形电极和15μm的直径为15μm的圆柱形电极的晶片上，其间隔为3行3列时，间隔为3行3列，在 圆柱形电极的电极形成为3列3列，该压敏粘合剂层在电极的高度为7.5μm或更小的部分处不接触。