公开(公告)号：US12122131B2

公开(公告)日：2024-10-22

申请号：US17320547

申请日：2021-05-14

申请人： SHINE OPTOELECTRONICS (KUNSHAN) CO., LTD.

发明人： Hao Chen ,  Lidong Liu ,  Yulong Gao ,  Guisheng Wang

IPC分类号： B32B3/26 ,  B05D5/06 ,  B32B5/14 ,  B32B17/06 ,  B32B27/06 ,  B32B33/00 ,  B44C3/02 ,  B44F1/08 ,  C23C28/00 ,  H05K5/02 ,  H05K5/03 ,  B32B3/30 ,  B32B7/023 ,  B32B15/04 ,  B44F1/04 ,  C23C14/00 ,  H04M1/02

CPC分类号： B32B3/26 ,  B05D5/06 ,  B32B5/142 ,  B44C3/02 ,  B44F1/08 ,  C23C28/00 ,  C23C28/40 ,  H05K5/0243 ,  H05K5/03 ,  B05D5/065 ,  B05D5/066 ,  B32B3/30 ,  B32B7/023 ,  B32B15/04 ,  B32B17/06 ,  B32B27/06 ,  B32B33/00 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/28 ,  B32B2307/402 ,  B32B2307/414 ,  B32B2307/416 ,  B32B2307/418 ,  B32B2451/00 ,  B32B2457/00 ,  B44F1/04 ,  C23C14/0015 ,  H04M1/0283 ,  Y10S428/9133 ,  Y10T428/162 ,  Y10T428/164 ,  Y10T428/24479 ,  Y10T428/24521 ,  Y10T428/24537 ,  Y10T428/24545 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/2495

摘要： The present application discloses a decorative sheet including a supporting layer and a solid film layer. The solid film layer is disposed on the supporting layer and presents a color. The solid film layer includes a single layer or a composite layer. A thickness and/or material of at least one layer in the solid film layer is set to be varied. In this application, through the change of the thickness and/or material of the solid film layer, the color of the solid film layer can be changed, including shade changes, color changes and other variety changes, so that the decorative sheet has rich color, rich vision, better decoration effect and higher recognition. Furthermore, the present application further discloses a cover plate for a consumer electronic product with the above-mentioned decorative sheet.

公开(公告)号：US20240344164A1

公开(公告)日：2024-10-17

申请号：US18646241

申请日：2024-04-25

申请人： POSCO CO., LTD

发明人： Ki-Cheol Kang ,  Chung-Hwan Lee ,  Yong-Joo Kim ,  Kang-Min Lee ,  Kyoo-Young Lee

IPC分类号： C21D9/46 ,  B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  C21D1/19 ,  C21D1/25 ,  C21D1/76 ,  C21D1/84 ,  C21D3/04 ,  C21D6/00 ,  C21D8/02 ,  C21D9/56 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C22C38/18 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  C22C38/38 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/58 ,  C23C2/02 ,  C23C2/06 ,  C23C2/28 ,  C23C2/40 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00

CPC分类号： C21D9/46 ,  B32B15/01 ,  B32B15/013 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  C21D1/19 ,  C21D1/25 ,  C21D1/76 ,  C21D1/84 ,  C21D3/04 ,  C21D6/002 ,  C21D6/005 ,  C21D6/008 ,  C21D8/0205 ,  C21D8/0226 ,  C21D8/0236 ,  C21D8/0257 ,  C21D8/0263 ,  C21D8/0273 ,  C21D8/0278 ,  C21D9/562 ,  C22C38/001 ,  C22C38/008 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C22C38/18 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  C22C38/38 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/58 ,  C23C2/02 ,  C23C2/022 ,  C23C2/0224 ,  C23C2/024 ,  C23C2/06 ,  C23C2/28 ,  C23C2/29 ,  C23C2/40 ,  C23C28/025 ,  C23C28/3225 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  B32B2307/732 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12799 ,  Y10T428/12958 ,  Y10T428/12965 ,  Y10T428/12972 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24983 ,  Y10T428/26 ,  Y10T428/27 ,  Y10T428/273

摘要： The present disclosure relates to a high-strength hot-dip galvanized steel sheet having excellent surface quality and electrical resistance spot weldability, and a method for manufacturing the same. A galvanized steel sheet according to an aspect of the present disclosure is a galvanized steel sheet including a base steel sheet and a zinc-based plating layer formed on a surface of the base steel sheet, wherein a ratio (a/b) of a hardness of a surface layer portion (a) to a hardness of an internal portion (b) of the base steel sheet may be less than 0.95.

公开(公告)号：US12112976B2

公开(公告)日：2024-10-08

申请号：US17088426

申请日：2020-11-03

申请人： Soitec

发明人： Fabrice Letertre ,  Oleg Kononchuk

IPC分类号： H01L21/762 ,  B32B7/12 ,  B32B9/04 ,  B32B38/00 ,  C30B29/68 ,  C30B33/00 ,  C30B33/06 ,  H01L21/02 ,  H01L21/18 ,  H01L27/12 ,  H01L33/00

CPC分类号： H01L21/76251 ,  B32B7/12 ,  B32B9/04 ,  C30B29/68 ,  C30B33/00 ,  C30B33/06 ,  H01L21/02002 ,  H01L21/185 ,  H01L27/1203 ,  B32B2457/14 ,  H01L33/0093 ,  Y10T156/1062 ,  Y10T428/24942

摘要： The invention relates to a method for fabricating a pseudo-substrate comprising the steps of providing a single crystal ingot, providing a handle substrate, cutting a thin slice from the single crystal ingot, and attaching the thin slice to the handle substrate to form a pseudo-substrate. According to the invention, the thickness of the thin slice is substantially equal or inferior to a critical thickness below which the slice, if taken alone, is no longer mechanically stable. The invention further relates to a semiconductor structure.

公开(公告)号：US12098744B2

公开(公告)日：2024-09-24

申请号：US17613257

申请日：2020-05-15

申请人： HYDROMECANIQUE ET FROTTEMENT

发明人： Fabrice Prost ,  Pierrick Pavallier

IPC分类号： F16C11/04 ,  B32B1/08 ,  B32B15/00 ,  B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  C23C8/00 ,  C23C8/02 ,  C23C8/04 ,  C23C8/06 ,  C23C8/18 ,  C23C8/22 ,  C23C8/26 ,  C23C8/32 ,  C23C8/38 ,  C23C8/50 ,  C23C8/56 ,  C23C8/66 ,  C23C8/70 ,  C23C8/76 ,  C23C8/80 ,  C23C14/06 ,  C23C14/22 ,  C23C14/48 ,  C23C14/58 ,  C23C30/00 ,  F16B1/00 ,  F16C31/02 ,  F16C33/12 ,  F16C33/20 ,  C21D1/06 ,  C21D1/74 ,  C21D9/40

CPC分类号： F16C11/04 ,  B32B1/08 ,  B32B15/00 ,  B32B15/01 ,  B32B15/011 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  C23C8/00 ,  C23C8/02 ,  C23C8/04 ,  C23C8/06 ,  C23C8/18 ,  C23C8/22 ,  C23C8/26 ,  C23C8/32 ,  C23C8/38 ,  C23C8/50 ,  C23C8/56 ,  C23C8/66 ,  C23C8/70 ,  C23C8/76 ,  C23C8/80 ,  C23C14/06 ,  C23C14/0641 ,  C23C14/0658 ,  C23C14/0664 ,  C23C14/067 ,  C23C14/221 ,  C23C14/48 ,  C23C14/58 ,  C23C14/5813 ,  C23C14/5833 ,  C23C14/584 ,  C23C14/586 ,  C23C30/00 ,  C23C30/005 ,  F16B1/00 ,  F16C31/02 ,  F16C33/12 ,  F16C33/208 ,  C21D1/06 ,  C21D1/74 ,  C21D9/40 ,  C21D2221/00 ,  C21D2261/00 ,  F16C2202/04 ,  F16C2202/06 ,  F16C2202/08 ,  F16C2204/60 ,  F16C2223/10 ,  F16C2223/14 ,  F16C2223/16 ,  F16C2240/60 ,  F16C2310/00 ,  F16C2352/00 ,  Y10T428/12292 ,  Y10T428/12458 ,  Y10T428/12576 ,  Y10T428/12583 ,  Y10T428/12611 ,  Y10T428/12958 ,  Y10T428/12972 ,  Y10T428/12993 ,  Y10T428/13 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24983 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265

摘要： A guiding member, having a body provided with a bore for mounting a mobile element is presented. The body consists of a metallic material. The bore has a surface layer treated against jamming over a diffusion depth of less than or equal to 0.6 mm. The surface layer has a hardness of greater than or equal to 500 Hv1 over a depth of between 5 and 50 μm.

公开(公告)号：US12083779B2

公开(公告)日：2024-09-10

申请号：US16642528

申请日：2018-02-28

申请人： Kimberly-Clark Worldwide, Inc.

发明人： Jose Augusto Vidal De Siqueira ,  Michael R. Vaughan

IPC分类号： B32B3/26 ,  A61F13/15 ,  A61F13/49 ,  B29C55/18 ,  B29C59/02 ,  B29C59/04 ,  B29C65/00 ,  B29C65/02 ,  B32B3/30 ,  B32B5/02 ,  B32B7/022 ,  B32B7/05 ,  B32B7/12 ,  B32B25/08 ,  B32B25/10 ,  B32B27/02 ,  B32B27/12 ,  B32B27/32 ,  B32B37/00 ,  B32B38/18 ,  A61L15/24 ,  B32B3/08 ,  B32B5/14 ,  B32B5/26 ,  B32B7/04 ,  B32B25/14 ,  B32B27/08 ,  B32B27/30 ,  B32B37/04 ,  B32B37/14 ,  B32B38/00

CPC分类号： B32B3/266 ,  A61F13/15203 ,  A61F13/49019 ,  A61F13/4902 ,  B29C55/18 ,  B29C59/02 ,  B29C59/04 ,  B29C65/00 ,  B29C65/02 ,  B32B3/26 ,  B32B3/30 ,  B32B5/022 ,  B32B7/022 ,  B32B7/05 ,  B32B7/12 ,  B32B25/08 ,  B32B25/10 ,  B32B27/02 ,  B32B27/12 ,  B32B27/32 ,  B32B37/0053 ,  B32B38/1808 ,  A61F2013/15406 ,  A61F2013/15552 ,  A61F2013/49023 ,  A61F2013/49025 ,  A61F2013/49093 ,  A61L15/24 ,  B32B3/085 ,  B32B5/02 ,  B32B5/142 ,  B32B5/147 ,  B32B5/266 ,  B32B7/04 ,  B32B25/14 ,  B32B27/08 ,  B32B27/302 ,  B32B37/0076 ,  B32B2037/0092 ,  B32B37/04 ,  B32B37/14 ,  B32B2038/0028 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2250/242 ,  B32B2250/246 ,  B32B2250/40 ,  B32B2262/0253 ,  B32B2274/00 ,  B32B2305/18 ,  B32B2307/51 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/724 ,  B32B2307/726 ,  B32B2307/7265 ,  B32B2309/02 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2555/02 ,  Y10T428/24298 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24446 ,  Y10T428/2457 ,  Y10T428/24942 ,  Y10T428/24992 ,  Y10T428/27 ,  Y10T442/659 ,  Y10T442/678 ,  Y10T442/679

摘要： An elastic laminate is provided including outer facing layers of a fabric and, located between the outer facing layers, a series of individual, spaced apart strips of elastic film extending continuously along the direction of elasticity. The film strips are formed by a controlled tearing of a continuous film while the film is biaxially stretched and bonded to the fabric facings. The fabric facings have gathers formed therein that allow the elastic laminate to stretch at least to the extent that the gathers can be pulled flat.

公开(公告)号：US12031213B2

公开(公告)日：2024-07-09

申请号：US17595570

申请日：2020-07-09

申请人： SHOWA DENKO K.K.

发明人： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki ,  Fumiaki Naka

IPC分类号： B32B15/01 ,  B32B3/10 ,  B32B3/26 ,  B32B3/30 ,  B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00 ,  C25D3/12 ,  H01J37/32 ,  C22C38/44 ,  C23C16/44

CPC分类号： C23C28/322 ,  B32B3/10 ,  B32B3/266 ,  B32B3/30 ,  B32B15/01 ,  B32B15/015 ,  B32B15/017 ,  B32B15/018 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/02 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C23C28/321 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  C25D3/12 ,  H01J37/32477 ,  C22C38/44 ,  C23C16/4404 ,  C23C18/1824 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/249953 ,  Y10T428/26 ,  Y10T428/265

摘要： A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US12000008B2

公开(公告)日：2024-06-04

申请号：US17787174

申请日：2020-12-18

申请人： POSCO

发明人： Ki-Cheol Kang ,  Chung-Hwan Lee ,  Yong-Joo Kim ,  Kang-Min Lee ,  Kyoo-Young Lee

IPC分类号： B32B15/01 ,  B32B15/04 ,  B32B15/18 ,  C21D1/19 ,  C21D1/25 ,  C21D1/76 ,  C21D1/84 ,  C21D3/04 ,  C21D6/00 ,  C21D8/02 ,  C21D9/46 ,  C21D9/56 ,  C22C38/00 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C22C38/18 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  C22C38/38 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/58 ,  C23C2/02 ,  C23C2/06 ,  C23C2/28 ,  C23C2/40 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00

CPC分类号： C21D9/46 ,  B32B15/01 ,  B32B15/013 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  C21D1/19 ,  C21D1/25 ,  C21D1/76 ,  C21D1/84 ,  C21D3/04 ,  C21D6/002 ,  C21D6/005 ,  C21D6/008 ,  C21D8/0205 ,  C21D8/0226 ,  C21D8/0236 ,  C21D8/0257 ,  C21D8/0263 ,  C21D8/0273 ,  C21D8/0278 ,  C21D9/562 ,  C22C38/001 ,  C22C38/008 ,  C22C38/02 ,  C22C38/04 ,  C22C38/06 ,  C22C38/12 ,  C22C38/14 ,  C22C38/18 ,  C22C38/22 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/34 ,  C22C38/38 ,  C22C38/44 ,  C22C38/46 ,  C22C38/48 ,  C22C38/50 ,  C22C38/58 ,  C23C2/02 ,  C23C2/022 ,  C23C2/0224 ,  C23C2/024 ,  C23C2/06 ,  C23C2/28 ,  C23C2/29 ,  C23C2/40 ,  C23C28/025 ,  C23C28/3225 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  B32B2307/732 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12799 ,  Y10T428/12958 ,  Y10T428/12965 ,  Y10T428/12972 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24983 ,  Y10T428/26 ,  Y10T428/27 ,  Y10T428/273

摘要： The present disclosure relates to a high-strength hot-dip galvanized steel sheet having excellent surface quality and electrical resistance spot weldability, and a method for manufacturing the same. A galvanized steel sheet according to an aspect of the present disclosure is a galvanized steel sheet including a base steel sheet and a zinc-based plating layer formed on a surface of the base steel sheet, wherein a ratio (a/b) of a hardness of a surface layer portion (a) to a hardness of an internal portion (b) of the base steel sheet may be less than 0.95.

公开(公告)号：US11961649B2

公开(公告)日：2024-04-16

申请号：US17674966

申请日：2022-02-18

申请人： Seiko Epson Corporation

发明人： Atsushi Nakamura

IPC分类号： H01F27/25 ,  B23K26/364 ,  H01F1/14 ,  H01F1/153 ,  H01F1/16 ,  H01F3/04 ,  H01F41/00 ,  H01F41/02 ,  B23K101/36

CPC分类号： H01F27/25 ,  B23K26/364 ,  H01F1/14 ,  H01F1/153 ,  H01F1/15341 ,  H01F1/16 ,  H01F3/04 ,  H01F41/00 ,  H01F41/02 ,  H01F41/0226 ,  B23K2101/36 ,  H01F1/15308 ,  Y10T428/12361 ,  Y10T428/12389 ,  Y10T428/12396 ,  Y10T428/12431 ,  Y10T428/12951 ,  Y10T428/12979 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/24967 ,  Y10T428/26 ,  Y10T428/266

摘要： An amorphous metal ribbon includes a plurality of laser irradiation mark rows each including a plurality of laser irradiation marks arranged in a row, in which when a distance between the laser irradiation mark rows that are adjacent to each other is set as d1, a distance between the laser irradiation marks in the laser irradiation mark row is set as d2, a diameter of the laser irradiation mark is set as d3, and a number density D of the laser irradiation marks is set as (1/d1)×(1/d2), the number density D of the laser irradiation marks is 0.05 pieces/mm2 or more and 0.50 pieces/mm2 or less, and when an area occupancy rate A of the laser irradiation marks is set as D×(d3/2)2×π×100, the area occupancy rate A of the laser irradiation marks is 0.0035% or more and 0.040% or less.

公开(公告)号：US11951726B2

公开(公告)日：2024-04-09

申请号：US17397923

申请日：2021-08-09

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Soo-jin Moon

IPC分类号： B32B37/18 ,  B32B38/10 ,  G02F1/1333 ,  B32B37/02 ,  B32B37/12 ,  B32B38/00

CPC分类号： B32B37/18 ,  B32B38/10 ,  G02F1/1333 ,  B32B37/02 ,  B32B37/12 ,  B32B38/0004 ,  B32B2307/21 ,  B32B2309/105 ,  B32B2457/20 ,  Y10T428/24942 ,  Y10T428/26 ,  Y10T428/266 ,  Y10T428/28 ,  Y10T428/2848

摘要： A method of manufacturing a flexible display substrate using a process film and a process film for manufacturing a flexible display substrate are provided. The method of manufacturing the flexible display substrate using the process film is as follows. A base layer for the flexible display substrate is prepared on a glass substrate. A packaging process is performed on the base layer to form a plurality of cells which are spaced apart from one another at a predetermined distance. The base layer is covered with the process film, after forming the plurality of cells. The base layer is separated from the glass substrate, while the base layer is laminated to the process film. The base layer is cut along each cell to form a plurality of flexible display substrates. Accordingly, the method of manufacturing the flexible display substrate using the process film is provided to improve the convenience of a manufacturing process and the reliability of the manufactured flexible display substrate by manufacturing the plurality of display substrates using the process film.

公开(公告)号：US11931828B2

公开(公告)日：2024-03-19

申请号：US18169192

申请日：2023-02-14

申请人： ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD.

发明人： Sujuan Zhong ,  Yongtao Jiu ,  Yafang Cheng ,  Junlan Huang ,  Tianran Ding ,  Guanxing Zhang ,  Quanbin Lu

IPC分类号： B23K35/02 ,  B23K35/22 ,  B23K35/30 ,  B23K35/365 ,  B23K35/40 ,  B32B1/08 ,  B32B7/02 ,  B32B15/01 ,  B32B15/02 ,  B32B15/04 ,  B32B15/20 ,  C22C9/00 ,  C22C9/02 ,  C23C2/08 ,  C23C2/38 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00

CPC分类号： B23K35/0227 ,  B23K35/0261 ,  B23K35/0272 ,  B23K35/22 ,  B23K35/302 ,  B23K35/365 ,  B23K35/40 ,  B23K35/404 ,  B23K35/406 ,  B32B1/08 ,  B32B7/02 ,  B32B15/01 ,  B32B15/02 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  C22C9/00 ,  C22C9/02 ,  C23C2/08 ,  C23C2/38 ,  C23C28/02 ,  C23C28/021 ,  C23C28/32 ,  C23C28/321 ,  C23C28/322 ,  C23C30/00 ,  C23C30/005 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12882 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/26

摘要： The present disclosure provides a copper-phosphorus-tin brazing wire and a preparation method thereof, relates to the technical field of brazing materials. The copper-phosphorus-tin brazing wire is of a three-layer structure, the inner layer is Cu, the middle layer is Cu-14P alloy, and the outer layer is Sn, wherein the mass percentage of Sn is over 7%. The present disclosure solves the technical problems in the prior art that the copper-phosphorus-silver brazing filler metal is prone to produce defects such as pores and inclusions when brazing copper alloys, which leads to the decline of the mechanical properties of the joint, and simultaneously provides the preparation method of the copper-phosphorus-tin brazing wire, such that the technical problem that it is difficult to obtain copper-phosphorus-tin brazing wire with a wire diameter below 0.5 mm under the condition of high Sn content is solved.