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    PACKAGING STRUCTURE
    2.
    发明申请
    PACKAGING STRUCTURE 有权
    包装结构

    公开(公告)号：US20130301228A1

    公开(公告)日：2013-11-14

    申请号：US13981123

    申请日：2012-01-20

    申请人： Yujuan Tao ,  Lei Shi ,  Guohua Gao ,  Guoji Yang ,  Honglei Li ,  Haijun Shen

    发明人： Yujuan Tao ,  Lei Shi ,  Guohua Gao ,  Guoji Yang ,  Honglei Li ,  Haijun Shen

    IPC分类号： H05K1/18

    CPC分类号： H05K1/181 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/96 ,  H01L25/165 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/821 ,  H01L2924/12042 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The present invention relates a packaging structure including: a carrier board and a cementing layer on the surface of the carrier board; chips and passive devices having functional side thereof attached to the cementing layer; and a sealing material layer for packaging and curing, the sealing material being formed on the carrier board on the side attached to the chips and the passive devices. The present invention integrates chips and passive devices and then packages the chips and the passive devices together, and is therefore a packaged product having not single-chip functionality but integrated-system functionality. The present invention is highly integrated, reduces interfering factors such as system-internal electric resistance and inductance, and accommodates growing demand for lighter, thinner, shorter, and smaller semiconductor packaging.

    摘要翻译： 本发明涉及一种包装结构，包括：承载板和承载板表面上的固井层; 芯片和其功能侧的被动装置连接到固着层; 以及用于包装和固化的密封材料层，所述密封材料形成在所述载板上，所述密封材料层与所述芯片和所述无源器件相连。 本发明集成了芯片和无源器件，然后将芯片和无源器件封装在一起，因此是不具有单芯片功能但集成系统功能的封装产品。 本发明是高度集成的，减少诸如系统内部电阻和电感的干扰因素，并且适应对更轻，更薄，更短和更小的半导体封装的不断增长的需求。