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公开(公告)号:US09497862B2
公开(公告)日:2016-11-15
申请号:US13981123
申请日:2012-01-20
申请人: Lei Shi , Yujuan Tao , Guohua Gao , Guoji Yang , Honglei Li , Haijun Shen
发明人: Lei Shi , Yujuan Tao , Guohua Gao , Guoji Yang , Honglei Li , Haijun Shen
IPC分类号: H01L23/34 , H05K1/18 , H01L21/56 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/16 , H01L23/00
CPC分类号: H05K1/181 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/96 , H01L25/165 , H01L2224/12105 , H01L2224/24195 , H01L2224/821 , H01L2924/12042 , H01L2924/1815 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要: The present invention relates a packaging structure including: a carrier board and a cementing layer on the surface of the carrier board; chips and passive devices having functional side thereof attached to the cementing layer; and a sealing material layer for packaging and curing, the sealing material being formed on the carrier board on the side attached to the chips and the passive devices. The present invention integrates chips and passive devices and then packages the chips and the passive devices together, and is therefore a packaged product having not single-chip functionality but integrated-system functionality. The present invention is highly integrated, reduces interfering factors such as system-internal electric resistance and inductance, and accommodates growing demand for lighter, thinner, shorter, and smaller semiconductor packaging.
摘要翻译: 本发明涉及一种包装结构,包括:承载板和承载板表面上的固井层; 芯片和其功能侧的被动装置连接到固着层; 以及用于包装和固化的密封材料层,所述密封材料形成在所述载板上,所述密封材料层与所述芯片和所述无源器件相连。 本发明集成了芯片和无源器件,然后将芯片和无源器件封装在一起,因此是不具有单芯片功能但集成系统功能的封装产品。 本发明是高度集成的,减少诸如系统内部电阻和电感的干扰因素,并且适应对更轻,更薄,更短和更小的半导体封装的不断增长的需求。
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公开(公告)号:US20130301228A1
公开(公告)日:2013-11-14
申请号:US13981123
申请日:2012-01-20
申请人: Yujuan Tao , Lei Shi , Guohua Gao , Guoji Yang , Honglei Li , Haijun Shen
发明人: Yujuan Tao , Lei Shi , Guohua Gao , Guoji Yang , Honglei Li , Haijun Shen
IPC分类号: H05K1/18
CPC分类号: H05K1/181 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/96 , H01L25/165 , H01L2224/12105 , H01L2224/24195 , H01L2224/821 , H01L2924/12042 , H01L2924/1815 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要: The present invention relates a packaging structure including: a carrier board and a cementing layer on the surface of the carrier board; chips and passive devices having functional side thereof attached to the cementing layer; and a sealing material layer for packaging and curing, the sealing material being formed on the carrier board on the side attached to the chips and the passive devices. The present invention integrates chips and passive devices and then packages the chips and the passive devices together, and is therefore a packaged product having not single-chip functionality but integrated-system functionality. The present invention is highly integrated, reduces interfering factors such as system-internal electric resistance and inductance, and accommodates growing demand for lighter, thinner, shorter, and smaller semiconductor packaging.
摘要翻译: 本发明涉及一种包装结构,包括:承载板和承载板表面上的固井层; 芯片和其功能侧的被动装置连接到固着层; 以及用于包装和固化的密封材料层,所述密封材料形成在所述载板上,所述密封材料层与所述芯片和所述无源器件相连。 本发明集成了芯片和无源器件,然后将芯片和无源器件封装在一起,因此是不具有单芯片功能但集成系统功能的封装产品。 本发明是高度集成的,减少诸如系统内部电阻和电感的干扰因素,并且适应对更轻,更薄,更短和更小的半导体封装的不断增长的需求。
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公开(公告)号:US10124133B2
公开(公告)日:2018-11-13
申请号:US14235771
申请日:2012-06-07
申请人: Honglei Li , Sheng Wang , Li Han
发明人: Hua Li , Honglei Li , Sheng Wang , Li Han
摘要: An electronic flow monitor, a control method and an anesthesia machine. The electronic flow controller can comprise a control module, an oxygen gas branch for delivering oxygen gas, an equilibrium gas branch for delivering equilibrium gas, and a gas mixing branch for mixing the oxygen gas and the equilibrium gas. The control module can meter an oxygen gas flow and an equilibrium gas flow through flow sensors. A first flow controller can be disposed in the oxygen gas branch, and a second flow controller can be disposed in the equilibrium gas branch. The first flow controller may be used to regulate the gas flow in the oxygen gas branch between zero and a maximum value and the second flow controller may be used to regulate the gas flow in the equilibrium gas branch between zero and a maximum value.
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