公开(公告)号：US20240363519A1

公开(公告)日：2024-10-31

申请号：US18307082

申请日：2023-04-26

申请人： NXP USA, INC.

发明人： Michael B. Vincent ,  Ankur Shah ,  Namrata Kanth

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/538 ,  H01L25/16

CPC分类号： H01L23/4985 ,  H01L21/4853 ,  H01L21/566 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/162 ,  H01L25/165 ,  H01L21/486 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/08235 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2924/182

摘要： A method of forming a semiconductor device is provided. The method includes placing a semiconductor die on a carrier substrate and affixing a rigid-flex sub-assembly on the semiconductor die. The rigid-flex sub-assembly includes a rigid portion and a flex portion having a conductive trace. A distal region of the flex portion is bent such that the bent distal region is not coplanar with the rigid portion. An encapsulant encapsulates at least a portion of the semiconductor die and the rigid-flex sub-assembly.

公开(公告)号：US20240339442A1

公开(公告)日：2024-10-10

申请号：US18131998

申请日：2023-04-07

申请人： Rockwell Collins, Inc.

发明人： Orion D. Davies ,  Haley M. Steffen

IPC分类号： H01L25/16 ,  H01L23/498 ,  H01L23/552

CPC分类号： H01L25/165 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/552

摘要： A package is described. The package includes a die covered by a lid. The lid maintains a hermetic seal for the die. The package includes high frequency shunt capacitance in parallel with surface-mount capacitors. The high frequency shunt capacitance is formed by interdigital capacitors below the surface-mount capacitors. The interdigital capacitors, the surface-mount capacitors, and the die form a circuit which produces a stable output voltage. The output voltage may remain stable even when subject to noise due to energized particles in space. The package includes solder resist with openings for attaching the surface-mount capacitors to the interdigital capacitors. Advantageously, the interdigital capacitors may achieve high frequency shunt capacitance on the order of nano-farads as part of the frame geometry with minimal increase in package height.

公开(公告)号：US20240312917A1

公开(公告)日：2024-09-19

申请号：US18026083

申请日：2022-05-20

申请人： Hefei BOE Ruisheng Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

发明人： Tingwei HAN ,  Zouming XU ,  Jie WANG ,  Xintao WU ,  Jiawei XU ,  Ningyu LUO

IPC分类号： H01L23/538 ,  H01L25/16

CPC分类号： H01L23/5386 ,  H01L25/165 ,  H01L25/167

摘要： Provided are a wiring substrate and an electronic device, the wiring substrate includes a substrate; first pad group, arranged on the substrate, each of the first pad group including an output pad; a constant voltage signal line, arranged on a same side of the substrate as the first pad group; and second pad groups, including a plurality of sub-pad groups connected in parallel, each of the sub-pad groups including a plurality of pad regions connected in series.

公开(公告)号：US12094864B2

公开(公告)日：2024-09-17

申请号：US18315758

申请日：2023-05-11

申请人： Apple Inc.

发明人： Andreas Bibl ,  Charles R. Griggs

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L25/075 ,  H01L27/02 ,  H01L27/12 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/12044 ,  H01L2924/00

摘要： Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20240282660A1

公开(公告)日：2024-08-22

申请号：US18398043

申请日：2023-12-27

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenshi TERASHIMA

IPC分类号： H01L23/367 ,  H01L25/16

CPC分类号： H01L23/3675 ,  H01L25/165 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49175

摘要： A semiconductor device, including: a semiconductor chip bonded to a substrate; a heat dissipation base including a fastening portion connected to a heat dissipation portion, the substrate being disposed in a substrate area on the heat dissipation portion, the fastening portion having a fastening hole formed therein; and a case including a protection portion beside an opening area, the protection portion having a fixing hole formed therein corresponding to the fastening hole, the case being disposed on the heat dissipation base so that the substrate is accommodated in the opening area and the protection portion is disposed on the fastening portion. A boundary between the fastening portion and the heat dissipation portion is located outside the opening area of the case in the plan view, and the fastening portion is located lower than the front surface of the heat dissipation portion in a side view of the semiconductor device.

公开(公告)号：US12051680B2

公开(公告)日：2024-07-30

申请号：US17735158

申请日：2022-05-03

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Tae Hwan Kim ,  Hyung Gil Baek ,  Young-Ja Kim ,  Kang Gyune Lee ,  Sang-Won Lee ,  Yong Kwan Lee

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/162 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/165 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/165 ,  H01L2924/1659 ,  H01L2924/182

摘要： A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.

公开(公告)号：US20240243113A1

公开(公告)日：2024-07-18

申请号：US18096174

申请日：2023-01-12

申请人： Apple Inc.

发明人： Sidharth S. Dalmia

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552

CPC分类号： H01L25/165 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/552 ,  H01L24/16 ,  H01L2224/16225

摘要： A system-in-package for an electronic device with a reduced thickness is presented herein. The system-in-package includes a stepped mold, an insulation film substrate, at least one processor die, and at least one passive element. The insulation film substrate is connected to a multi-layer board via a first plurality of connectors. The at least one processor die is integrated into the stepped mold and stacked onto the insulation film substrate via a second plurality of connectors. The at least one passive element is integrated into the stepped mold and stacked onto the insulation film substrate.

公开(公告)号：US20240234393A1

公开(公告)日：2024-07-11

申请号：US17928286

申请日：2022-11-03

申请人： LEORIA Inc.

发明人： Jun Cheol KO

IPC分类号： H01L25/16 ,  H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/36

CPC分类号： H01L25/167 ,  H01L25/165 ,  H05K3/005 ,  H05K3/06 ,  H05K3/244 ,  H05K3/363

摘要： A method for manufacturing a transparent LED display device includes forming a line of a grid-shaped metal mesh pattern on a first surface of both surfaces of a transparent heat-resistant optical PET by using a wet etching method on a transparent heat-resistant optical PET film, punching a hole in the transparent heat-resistant optical PET film and soldering a line of a controller PCB placed on a second surface of both the surfaces of the transparent heat-resistant optical PET and the line of the metal mesh pattern on the first surface to electrically connect the controller PCB to the line of the metal mesh pattern, mounting color LEDs on the first surface of the transparent heat-resistant optical PET film, and integrally coupling the SMPS to the transparent heat-resistant optical PET film.

公开(公告)号：US20240234270A1

公开(公告)日：2024-07-11

申请号：US18395626

申请日：2023-12-25

申请人： STATS ChipPAC Pte. Ltd.

发明人： ChangOh KIM ,  JinHee JUNG ,  OMin KWON

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L23/552 ,  H01L25/16

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/5383 ,  H01L23/552 ,  H01L25/165 ,  H01L24/16 ,  H01L2224/16225

摘要： A semiconductor device and a method for making the same are provided. The method includes: providing a substrate having a first surface and a second surface opposite to the first surface, wherein a plurality of conductive pillars are formed on the second surface of the substrate; forming a polyimide layer on the second surface of the substrate to cover the plurality of conductive pillars; mounting a first electronic component on the first surface of the substrate; and forming a first encapsulant on the first surface of the substrate to cover the first electronic component.

公开(公告)号：US20240222256A1

公开(公告)日：2024-07-04

申请号：US18545757

申请日：2023-12-19

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kenichi Koi

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L23/49861 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/165 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2924/181

摘要： An electronic apparatus includes a first metal layer, a component mounting substrate, a second metal layer, and sealing resin. The first metal layer includes a first mounting portion and a second mounting portion. The component mounting substrate includes an electronic component mounted on the first mounting portion. The second metal layer is arranged on the first metal layer such that the second metal layer and the second mounting portion sandwich a driving component. The sealing resin fills a space between the first metal layer and the second metal layer, covers the component mounting substrate, and seals the electronic component and the driving component. The first metal layer includes a terminal portion that protrudes from the first mounting portion toward the second metal layer. The second metal layer includes a wire portion that comes into contact with the terminal portion and connects the second metal layer to the first mounting portion.