公开(公告)号：US20180069371A1

公开(公告)日：2018-03-08

申请号：US15433747

申请日：2017-02-15

Applicant: Lumentum Operations LLC

Inventor： Jack XU ,  Yonghong GUO ,  Nicolas GUERIN ,  Lihua WANG ,  Yaogeng DING

IPC: H01S5/022

CPC classification number: H01S5/02212 ,  H01S5/02284 ,  H01S5/02469 ,  H01S5/02492

Abstract: A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other.