公开(公告)号：US20180337315A1

公开(公告)日：2018-11-22

申请号：US15777295

申请日：2016-10-19

申请人： Lumileds Holding B.V.

发明人： Wen YU ,  Oleg B. SHCHEKIN ,  Franklin WALL ,  Kuochou TAI ,  Mohiuddin MALA ,  Robert ZONA ,  Jeffrey KMETEC ,  Alexander NICKEL

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L23/00

CPC分类号： H01L27/153 ,  H01L33/38 ,  H01L33/62

摘要： Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.