公开(公告)号：US20250054130A1

公开(公告)日：2025-02-13

申请号：US18798858

申请日：2024-08-09

Applicant: MEDIATEK INC.

Inventor： En Jen ,  Shao-Yun Liu ,  Yi-Ju Ting ,  Chin-Tang Lai ,  Chia-Shun Yeh ,  Ching-Yu Lin ,  Ching-Han Jan ,  Po-Hsuan Huang

IPC: G06T7/00 ,  G06V10/762

Abstract: A wafer map recognition method using artificial intelligence includes obtaining wafer maps of a plurality of wafers; performing an unsupervised algorithm on the wafer map of each wafer in the plurality of wafers to generate a feature data set for the corresponding wafer map; and performing a clustering algorithm according to a plurality of feature data sets for the plurality of wafer maps to find a wafer map with a potential defect.