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公开(公告)号：US20230063481A1
公开(公告)日：2023-03-02
申请号：US17463587
申请日：2021-09-01
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Amir Silber , Barak Freedman , Nizan Meitav , Santiago Echeverri , Jochem Verbist , Allan Green-Petersen
Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.
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公开(公告)号：US12174238B2
公开(公告)日：2024-12-24
申请号：US17463587
申请日：2021-09-01
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Amir Silber , Barak Freedman , Nizan Meitav , Santiago Echeverri , Jochem Verbist , Allan Green-Petersen
Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.
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