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公开(公告)号：US20230288472A1
公开(公告)日：2023-09-14
申请号：US17894871
申请日：2022-08-24
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Amir Silber
CPC classification number: G01R31/2886 , G01B11/24 , G01N21/9501 , G06T7/0004 , G06T7/62 , G06T2207/30148 , G06T2200/04
Abstract: A substrate testing device includes a first testing component configured to couple to electrical pads of a substrate and perform electrical testing on one or more dies of the substrate during a test. The substrate testing device includes a second testing component configured to perform optical testing of the one or more dies during the test. The substrate testing device further includes a third testing component comprising a three-dimensional scanner configured to perform a dimensional scan of the one or more dies of the substrate, wherein the third testing component is to perform geometrical testing on the one or more dies during the test.
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Patent Agency Ranking
公开(公告)号：US12135461B2
公开(公告)日：2024-11-05
申请号：US17649849
申请日：2022-02-03
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Henning Lysdal , Amir Silber , Nizan Meitav
Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.
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公开(公告)号：US20230063481A1
公开(公告)日：2023-03-02
申请号：US17463587
申请日：2021-09-01
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Amir Silber , Barak Freedman , Nizan Meitav , Santiago Echeverri , Jochem Verbist , Allan Green-Petersen
Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.
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公开(公告)号：US20220276452A1
公开(公告)日：2022-09-01
申请号：US17649849
申请日：2022-02-03
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Henning Lysdal , Amir Silber , Nizan Meitav
IPC: G02B6/42
Abstract: Various embodiments of silicon photonic (SiP) chips are provided that are configured for backside or frontside optical fiber coupling. An SiP chip includes a photonic integrated circuit formed on a first surface of a first substrate. The photonic integrated circuit includes at least one optical component and at least one coupling element. The at least one optical component is configured to propagate an optical signal therethrough in a waveguide propagation direction that is substantially parallel to a plane defined by the first surface. The at least one coupling element is configured to couple an optical signal propagating along an optical path transverse to the waveguide propagation direction into the at least one optical component to enable the backside or frontside coupling of an optical fiber to the SiP chip.
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公开(公告)号：US12174238B2
公开(公告)日：2024-12-24
申请号：US17463587
申请日：2021-09-01
Applicant: MELLANOX TECHNOLOGIES, LTD.
Inventor： Amir Silber , Barak Freedman , Nizan Meitav , Santiago Echeverri , Jochem Verbist , Allan Green-Petersen
Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.
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公开(公告)号：US12135348B2
公开(公告)日：2024-11-05
申请号：US17894871
申请日：2022-08-24
Applicant: Mellanox Technologies, Ltd.
Inventor： Barak Freedman , Amir Silber
Abstract: A substrate testing device includes a first testing component configured to couple to electrical pads of a substrate and perform electrical testing on one or more dies of the substrate during a test. The substrate testing device includes a second testing component configured to perform optical testing of the one or more dies during the test. The substrate testing device further includes a third testing component comprising a three-dimensional scanner configured to perform a dimensional scan of the one or more dies of the substrate, wherein the third testing component is to perform geometrical testing on the one or more dies during the test.
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