公开(公告)号：US11289835B2

公开(公告)日：2022-03-29

申请号：US16803135

申请日：2020-02-27

Applicant: MOTOROLA SOLUTIONS, INC.

Inventor： Chun Wen Ooi ,  Jorge L. Garcia ,  Siew Im Low ,  Kay Siang Sim ,  Wooi Ping Teoh

IPC: H05K1/11 ,  H01R12/70 ,  H01R12/71 ,  H05K1/03 ,  H05K1/09

Abstract: A printed circuit board (PCB) connector interface module and an accessory system. The module including a first layer, a second layer, and a plurality of inner layers. The first layer includes a first set of contact pads configured to electrically connect to an accessory device, and a heat and scratch resistant coverlay that is adjacent to and has a first surface that is level with a first surface of the first set of contact pads. The second layer including a second set of contact pads configured to electrically connect to an internal printed circuit board (PCB) of an electronic apparatus. The plurality of inner layers including one or more printed circuit boards (PCB) and a plurality of contact vias, wherein the plurality of contact vias electrically connect the first set of contact pads to the second set of contact pads.

公开(公告)号：US20210273358A1

公开(公告)日：2021-09-02

申请号：US16803135

申请日：2020-02-27

Applicant: MOTOROLA SOLUTIONS, INC.

Inventor： Chun Wen Ooi ,  Jorge L. Garcia ,  Siew Im Low ,  Kay Siang Sim ,  Wooi Ping Teoh

IPC: H01R12/70 ,  H01R12/71

Abstract: A printed circuit board (PCB) connector interface module and an accessory system. The module including a first layer, a second layer, and a plurality of inner layers. The first layer includes a first set of contact pads configured to electrically connect to an accessory device, and a heat and scratch resistant coverlay that is adjacent to and has a first surface that is level with a first surface of the first set of contact pads. The second layer including a second set of contact pads configured to electrically connect to an internal printed circuit board (PCB) of an electronic apparatus. The plurality of inner layers including one or more printed circuit boards (PCB) and a plurality of contact vias, wherein the plurality of contact vias electrically connect the first set of contact pads to the second set of contact pads.