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1.
公开(公告)号:US20190009369A1
公开(公告)日:2019-01-10
申请号:US15983866
申请日:2018-05-18
Applicant: MV Innovative Technologies, LLC
Inventor: Mikhail A. Vorontsov
IPC: B23K26/342 , G02B6/02 , B23K26/70
Abstract: A system that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. Laser beam arrays may be arranged in a two dimensional cluster and configured to provide a pre-defined spatiotemporal laser power density distribution, or may be arranged linearly and configured to provide oscillating focal spots along a wide processing line. These systems may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing, or a set of thermal management modules that pre-heat and post-heat material to control thermal gradient, or both.
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2.
公开(公告)号:US20190009358A1
公开(公告)日:2019-01-10
申请号:US15642884
申请日:2017-07-06
Applicant: MV Innovative Technologies, LLC
Inventor: Mikhail A. Vorontsov
IPC: B23K26/03 , H01S3/23 , H01S3/067 , H01S3/00 , B23K26/342 , B23K26/06 , B23K26/082 , B33Y10/00 , B33Y30/00 , B33Y50/02
CPC classification number: B23K26/032 , B23K26/0006 , B23K26/044 , B23K26/0608 , B23K26/0626 , B23K26/0676 , B23K26/082 , B23K26/0876 , B23K26/342 , B33Y10/00 , B33Y30/00 , B33Y50/02 , H01S3/0014 , H01S3/005 , H01S3/0071 , H01S3/067 , H01S3/2383
Abstract: A system for LAM that uses a scalable array of individually controllable laser beams that are generated by a fiber array system to process materials into an object using a powder bed, wire feed, or direct deposition. The adaptive control of individual beams may include beam power, focal spot width, centroid position, scanning orientation, amplitude and frequency, piston phase and polarization states of individual beams. These characteristics can be independently adjusted to control LAM characteristics including microstructure, mechanical and surface quality characteristics. The system may also have a set of material sensors that gather information on a material and environment immediately before, during, and immediately after processing. This information can be used to adapt the material processing routine to improve LAM productivity and parts quality. The system also supports a variety of beam shaping methods that improve the quality of produced objects or mitigate processing issues.
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