LASER BLANKING DEVICE
    2.
    发明公开

    公开(公告)号:US20240335906A1

    公开(公告)日:2024-10-10

    申请号:US18700020

    申请日:2022-11-16

    IPC分类号: B23K26/08 B23K26/38

    摘要: A laser blanking device includes an upstream laser head, a downstream laser head, and an inter-head conveyor. The upstream laser head emits a laser. The downstream laser head is disposed downstream of the upstream laser head in a conveyance direction of a workpiece, and emits a laser. The inter-head conveyor includes a loading section on which a workpiece is loaded between the upstream laser head and the downstream laser head, and conveys the workpiece loaded thereon. An end on the upstream side of the loading section is movable along the conveyance direction together with the upstream laser head. An end on the downstream side of the loading section is movable along the conveyance direction together with the downstream laser head.

    METHOD AND LASER PROCESSING APPARATUS FOR PRODUCING A BIPOLAR PLATE

    公开(公告)号:US20240082953A1

    公开(公告)日:2024-03-14

    申请号:US18515340

    申请日:2023-11-21

    申请人: TRUMPF Laser GmbH

    IPC分类号: B23K26/24 B23K26/08

    CPC分类号: B23K26/24 B23K26/0876

    摘要: A method for producing a bipolar plate includes providing a first plate element and a second plate element. The first plate element has at least one bead with a longitudinal extent. The method further includes forming a welded connection between the first plate element and the second plate element along the longitudinal extent by using a laser processing beam. The formation of the welded connection includes detecting a geometric feature of the at least one bead located in a transverse direction. The geometric feature is a deepest point or a point of defined depth of the at least one bead. The formation of the welded connection further includes readjusting the laser processing beam in the transverse direction to a position of the detected geometric feature, and welding the first plate element and the second plate element together at the position of the geometric feature.

    PORTABLE LASER CUTTER
    6.
    发明公开

    公开(公告)号:US20240009759A1

    公开(公告)日:2024-01-11

    申请号:US18369892

    申请日:2023-09-19

    申请人: RENDYR, INC.

    IPC分类号: B23K26/00 B23K26/08 B23K26/38

    摘要: A CNC machine includes a lower body; an upper body that extends from the lower body and is movably attached to the lower body; a tool that is movably attached to the upper body; and a flexible mat that is attached to the lower body. The tool may be a laser generator with the flexible mat resistant to the laser beam. The flexible mat has at least one orientation such that an outer periphery of the flexible mat is greater than the full extent of range of motion of the tool. The upper body may be connected to the lower body by a pivot mechanism configured to allow the upper body to pivot from a first position to a second position and to rotationally fix the upper body relative to the lower body in the second position, with the first and second positions being ninety degrees apart.

    LASER PROCESSING APPARATUS
    7.
    发明公开

    公开(公告)号:US20230415263A1

    公开(公告)日:2023-12-28

    申请号:US18339669

    申请日:2023-06-22

    申请人: DISCO CORPORATION

    发明人: Hiroshi MORIKAZU

    IPC分类号: B23K26/08 B23K26/082

    CPC分类号: B23K26/0876 B23K26/082

    摘要: A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator that emits a laser beam, an X-axis galvano scanner that induces the laser beam emitted by the laser oscillator in an X-axis direction, a Y-axis galvano scanner that induces the laser beam in a Y-axis direction, and a controller that controls the X-axis galvano scanner and the Y-axis galvano scanner. The controller includes a processing region storing section that stores the X-coordinate and Y-coordinate of processing regions in which a workpiece held by a chuck table is processed and an order-of-processing storing section that stores setting of the order of processing of the processing region to be processed on a forward path through irradiation with the laser beam and the processing region of a return path to be subsequently processed.

    LASER MACHINING METHOD AND LASER MACHINING SYSTEM

    公开(公告)号:US20230311247A1

    公开(公告)日:2023-10-05

    申请号:US18332588

    申请日:2023-06-09

    申请人: Gigaphoton Inc.

    发明人: Takashi ONOSE

    IPC分类号: B23K26/08 B23K26/38

    摘要: A laser machining method forms a machined portion in a machining area of a machining object by irradiating the machining area with a pulse laser beam. The laser machining method includes an irradiation process of irradiating the machining area with the pulse laser beam output from an excimer laser apparatus by guiding the pulse laser beam to part of the machining area and moving the guided pulse laser beam through irradiation spots, and a movement process of moving the machining object in a height direction of the machining object. The irradiation process is performed at a plurality of height positions on the machining object moved in the height direction in the movement process. In the irradiation process, at least part of each of the irradiation spots of the pulse laser beam overlaps another irradiation spot adjacent to the irradiation spot.

    LASER MILLING AND REMOVAL TOOL AND METHODS
    10.
    发明公开

    公开(公告)号:US20230151707A1

    公开(公告)日:2023-05-18

    申请号:US17530162

    申请日:2021-11-18

    摘要: Systems and methods for cutting objects within a subterranean well include a laser system having a laser drilling head located at a terminal downhole end of a laser tool body directing a head laser beam in a direction downhole. A laser scanner assembly located within the laser tool body has a scanner head directing a scanner laser beam and can move both axially along a length of the laser tool body and rotate around a central axis of the laser tool body. A laser cutter assembly located within the laser tool body has a cutter head directing a cutter laser beam and can rotate around the central axis of the laser tool body. A cable bundle formed of a plurality of fiber optic cables extends from an uphole end of the laser tool body to each of the laser drilling head, the laser scanner assembly, and the laser cutter assembly.