公开(公告)号：US11499234B2

公开(公告)日：2022-11-15

申请号：US16815114

申请日：2020-03-11

Applicant: Massachusetts Institute of Technology

Inventor： Melissa A. Smith ,  Bradley P. Duncan

IPC: C23D5/02 ,  H01L23/29

Abstract: In some embodiments, a method of forming a structure includes: forming a liquid oxide material at a low temperature by dissolving fumed nanoparticles in a liquid hydrate of a silicate or an aluminate; applying the liquid oxide material on a substrate; and at a low temperature, curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass.

公开(公告)号：US11217417B2

公开(公告)日：2022-01-04

申请号：US16872776

申请日：2020-05-12

Applicant: Massachusetts Institute of Technology

Inventor： Melissa A. Smith ,  Donna-Ruth W. Yost

IPC: H01J3/04 ,  H01J9/02 ,  H01J27/26

Abstract: In some embodiments, a self-aligned electrospray device can include a silicon wafer, a fluid reservoir, and a circuit. The silicon wafer can have a layer of electrically insulating material deposited on a top surface and a deposited layer of electrically conducting material. The silicon wafer and the deposited layers can have through holes. The electrically insulating layer may be undercut. The fluid reservoir can be mounted to a bottom surface of the silicon wafer for containing fluid. The circuit can provide an electric potential difference and be coupled between the layer of electrically conducting material and the fluid reservoir.

公开(公告)号：US11444027B2

公开(公告)日：2022-09-13

申请号：US16875367

申请日：2020-05-15

Applicant: Massachusetts Institute of Technology

Inventor： Mordechai Rothschild ,  Sumanth Kaushik ,  Melissa A. Smith ,  Livia Racz ,  Dennis Burianek

IPC: H01L23/528 ,  H01L23/48 ,  H01L21/78 ,  G01S19/37

Abstract: A wafer-scale satellite bus and a manner of making the same include using wafer reconstruction techniques to stack functional diced circuits onto each other and bond them. The disclosed techniques allow for a variety of functions in each die, including providing, without limitation: ground-based communications, attitude and propulsion control, fuel tanks and thrusters, and power generation. The wafers are initially manufactured according to a common wafer design that provides electrical and power interconnects, then different wafers are further processed using subsystem-specific techniques. The circuits on differently-processed wafers are reconstructed into a single stack using e.g. wafer bonding. Surface components are mounted, and the circuitry is diced to form the final satellites. Mission-specific functions can be incorporated, illustratively by surface-mounting, to the bus at an appropriate stage of assembly, on-wafer circuitry or instrument packages for performing these functions.

公开(公告)号：US20200291530A1

公开(公告)日：2020-09-17

申请号：US16815114

申请日：2020-03-11

Applicant: Massachusetts Institute of Technology

Inventor： Melissa A. Smith ,  Bradley P. Duncan

IPC: C23D5/02 ,  H01L23/29

Abstract: In some embodiments, a method of forming a structure includes: forming a liquid oxide material at a low temperature by dissolving fumed nanoparticles in a liquid hydrate of a silicate or an aluminate; applying the liquid oxide material on a substrate; and at a low temperature, curing the liquid oxide material to evolve gaseous water, leaving structural silicate glass.