公开(公告)号：US20190255335A1

公开(公告)日：2019-08-22

申请号：US16405032

申请日：2019-05-07

Applicant: Medtronic, Inc.

Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

IPC: A61N1/375 ,  A61N1/372 ,  A61N1/378 ,  A61N1/05 ,  A61N1/08

Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

公开(公告)号：US20170100597A1

公开(公告)日：2017-04-13

申请号：US15196643

申请日：2016-06-29

Applicant: Medtronic, Inc.

Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

IPC: A61N1/375 ,  A61N1/378 ,  A61N1/372 ,  A61N1/05 ,  A61N1/08

CPC classification number: A61N1/3758 ,  A61N1/05 ,  A61N1/08 ,  A61N1/37205 ,  A61N1/37223 ,  A61N1/3752 ,  A61N1/3754 ,  A61N1/3756 ,  A61N1/378 ,  A61N1/3787

Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

公开(公告)号：US11103714B2

公开(公告)日：2021-08-31

申请号：US16405032

申请日：2019-05-07

Applicant: Medtronic, Inc.

Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/372 ,  A61N1/378

Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.