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    SOLID STATE POWER SOURCE WITH FRAMES FOR ATTACHMENT TO AN ELECTRONIC CIRCUIT
    1.
    发明申请
    SOLID STATE POWER SOURCE WITH FRAMES FOR ATTACHMENT TO AN ELECTRONIC CIRCUIT 审中-公开
    具有用于连接到电子电路的框架的固态电源

    公开(公告)号：US20150155590A1

    公开(公告)日：2015-06-04

    申请号：US14622428

    申请日：2015-02-13

    Applicant: Medtronic, Inc. ,  Sapurast Research LLC

    Inventor： John K. Day ,  Michael W. Barror ,  Shawn W. Snyder ,  Alexandra Z. LaGuardia ,  Damon E. Lytle ,  Bernd J. Neudecker

    IPC: H01M10/04 ,  H01M10/42

    CPC classification number: H01M10/0436 ,  A61N1/378 ,  H01M2/0202 ,  H01M2/0267 ,  H01M2/0292 ,  H01M6/181 ,  H01M10/0427 ,  H01M10/0486 ,  H01M10/056 ,  H01M10/4257 ,  H01M2220/30 ,  Y10T428/24331

    Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

    Abstract translation: 固态器件的电源包括：具有第一接触部分，第一接合部分和第一接触部分与第一接合部分之间的第一延伸部分的第一框架; 具有第二接触部分的第二框架，第二接合部分和第二接合部分与第二接合部分之间的第二延伸部分; 以及位于第一和第二接触部之间的第一极层，电解质层和第二极层，其中电解质层的第一部分位于第一延伸部和第一极之间，电解质层的第二部分 位于第一延伸部和第二极之间。

    Sealed implantable medical device and method of forming same
    4.
    发明授权
    Sealed implantable medical device and method of forming same 有权

    公开(公告)号：US11103714B2

    公开(公告)日：2021-08-31

    申请号：US16405032

    申请日：2019-05-07

    Applicant: Medtronic, Inc.

    Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

    IPC: A61N1/375 ,  A61N1/05 ,  A61N1/372 ,  A61N1/378

    Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

    SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMING SAME
    6.
    发明申请
    SEALED IMPLANTABLE MEDICAL DEVICE AND METHOD OF FORMING SAME 审中-公开

    公开(公告)号：US20190255335A1

    公开(公告)日：2019-08-22

    申请号：US16405032

    申请日：2019-05-07

    Applicant: Medtronic, Inc.

    Inventor： Michael W. Barror ,  John K. Day ,  David A. Ruben ,  James D. Bradley

    IPC: A61N1/375 ,  A61N1/372 ,  A61N1/378 ,  A61N1/05 ,  A61N1/08

    Abstract: Various embodiments of a sealed package and a method of forming the package are disclosed. The package can include a housing extending along a housing axis between a first end and a second end, and an electronic device disposed within the housing that includes a device contact. The package can also include an external contact hermetically sealed to the housing at the first end of the housing, and a conductive member electrically connected to the external contact and the device contact such that the conductive member electrically connects the electronic device to the external contact. The conductive member is compressed between the external contact and the device contact.

    SOLID STATE POWER SOURCE WITH FRAMES FOR ATTACHMENT TO AN ELECTRONIC CIRCUIT
    7.
    发明申请
    SOLID STATE POWER SOURCE WITH FRAMES FOR ATTACHMENT TO AN ELECTRONIC CIRCUIT 有权
    具有用于连接到电子电路的框架的固态电源

    公开(公告)号：US20140154553A1

    公开(公告)日：2014-06-05

    申请号：US13692729

    申请日：2012-12-03

    Applicant: MEDTRONIC, INC.

    Inventor： John K. Day ,  Michael W. Barror ,  Shawn W. Snyder ,  Alexandra Z. LaGuardia ,  Damon E. Lytle ,  Bernd J. Neudecker

    IPC: H01M2/02

    CPC classification number: H01M10/0436 ,  A61N1/378 ,  H01M2/0202 ,  H01M2/0267 ,  H01M2/0292 ,  H01M6/181 ,  H01M10/0427 ,  H01M10/0486 ,  H01M10/056 ,  H01M10/4257 ,  H01M2220/30 ,  Y10T428/24331

    Abstract: A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.

    Abstract translation: 固态器件的电源包括：具有第一接触部分，第一接合部分和第一接触部分与第一接合部分之间的第一延伸部分的第一框架; 具有第二接触部分的第二框架，第二接合部分和第二接合部分与第二接合部分之间的第二延伸部分; 以及位于第一和第二接触部之间的第一极层，电解质层和第二极层，其中电解质层的第一部分位于第一延伸部和第一极之间，电解质层的第二部分 位于第一延伸部和第二极之间。

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