公开(公告)号：US20240385400A1

公开(公告)日：2024-11-21

申请号：US18198890

申请日：2023-05-18

Applicant: Mellanox Technologies, Ltd.

Inventor： Amit Oren ,  Barak FREEDMAN ,  Casper DIETRICH

IPC: G02B6/42 ,  H01L23/00 ,  H01L23/498

Abstract: Electronic devices, electronic modules, and methods for manufacturing electronic devices and/or electronic modules are described herein. Some embodiments of the present invention may be directed to an electronic module that includes a multi-chip module (MCM) substrate having a first surface configured to be connected to a system printed circuit board and a second surface defining a central portion and a peripheral portion. The electronic module may include a main die positioned on the central portion of the second surface of the MCM substrate and in electrical communication with electrical traces of the MCM substrate. The electronic module may include MCM sockets positioned on the peripheral portion of the MCM substrate, where each MCM socket is configured to engage and support a mezzanine package substrate such that a main portion of the mezzanine package substrate extends beyond the peripheral portion of the MCM substrate.

公开(公告)号：US11809001B2

公开(公告)日：2023-11-07

申请号：US17715136

申请日：2022-04-07

Applicant: Mellanox Technologies Ltd.

Inventor： Alon Rokach ,  Nimer Hazin ,  Amit Oren ,  Michael Greenman

IPC: H04B10/00 ,  G02B6/42 ,  H01R13/717

CPC classification number: G02B6/426 ,  G02B6/428 ,  G02B6/4251 ,  H01R13/7172

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.