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    Hydrophobic feature to control adhesive flow
    1.
    发明授权
    Hydrophobic feature to control adhesive flow 有权

    公开(公告)号：US12130482B2

    公开(公告)日：2024-10-29

    申请号：US17132851

    申请日：2020-12-23

    Applicant: Intel Corporation

    Inventor： Bassam Ziadeh ,  Jingyi Huang ,  Yiqun Bai ,  Ziyin Lin ,  Vipul Mehta ,  Joseph Van Nausdle

    IPC: G02B6/42

    CPC classification number: G02B6/4239 ,  G02B6/4212 ,  G02B6/423 ,  G02B6/426

    Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.

    OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME
    2.
    发明公开
    OPTICAL WAVEGUIDE MOUNTED SUBSTRATE AND METHOD OF MAKING THE SAME 审中-公开

    公开(公告)号：US20240353633A1

    公开(公告)日：2024-10-24

    申请号：US18636725

    申请日：2024-04-16

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Hisashi KANEDA

    IPC: G02B6/42 ,  G02B6/43

    CPC classification number: G02B6/426 ,  G02B6/43

    Abstract: An optical waveguide mounted substrate includes an interconnect substrate having a recess that opens on a first surface thereof, and an optical waveguide device including: an optical waveguide substrate including a support and a core layer disposed on the support; and a silicon photonic chip including a silicon substrate and a silicon waveguide disposed on the silicon substrate, the silicon waveguide being optically coupled with the core layer, wherein the optical waveguide substrate is mounted on the interconnect substrate such that the core layer faces away from the recess and at least a part of a thickness of the support is situated inside the recess.

    Optoelectronic module for receiving multiple optical connectors
    3.
    发明授权
    Optoelectronic module for receiving multiple optical connectors 有权

    公开(公告)号：US11953741B2

    公开(公告)日：2024-04-09

    申请号：US17931792

    申请日：2022-09-13

    Applicant: II-VI Delaware, Inc.

    Inventor： Long Van Nguyen

    IPC: H04B10/00 ,  G02B6/42 ,  G02B6/43

    CPC classification number: G02B6/4246 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/428 ,  G02B6/43

    Abstract: An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board (“PCB”) with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

    Optical port shielding and fastening apparatus, optical module, and communications device
    5.
    发明授权
    Optical port shielding and fastening apparatus, optical module, and communications device 有权

    公开(公告)号：US11747580B2

    公开(公告)日：2023-09-05

    申请号：US17851705

    申请日：2022-06-28

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Song Yang ,  Sufei Miao ,  Zhigang Wang ,  Liang Xu ,  Yu Huang

    IPC: H04B10/00 ,  G02B6/42 ,  H05K9/00

    CPC classification number: G02B6/4277 ,  G02B6/426 ,  H05K9/0058 ,  G02B6/428

    Abstract: An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.

    Light-emitting cable structure
    7.
    发明授权
    Light-emitting cable structure 有权

    公开(公告)号：US11675150B2

    公开(公告)日：2023-06-13

    申请号：US17180797

    申请日：2021-02-21

    Applicant: ENERGY FULL ELECTRONICS CO., LTD.

    Inventor： Hsu-Shen Chin

    IPC: G02B6/44 ,  G02B6/42 ,  F21V8/00

    CPC classification number: G02B6/4416 ,  G02B6/426 ,  G02B6/428 ,  G02B6/4249 ,  G02B6/4277 ,  G02B6/001

    Abstract: A light-emitting cable structure includes a light-emitting cable, a first circuit board, second circuit board, at least one light-emitting module and a covering casing. By placing a plurality of signal groups in the light-emitting cable below a plurality of optical fibers in the light-emitting cable for a certain distance and placing the signal groups outside the vertical projection of the optical fibers towards the signal groups, the light in the optical fibers is allowed to be emitted by the vertical projection, so that users can observe the light transmitted in the optical fibers from all sides of the light-emitting cable structure, which greatly increases the attractiveness of the product to consumers.

    Heat sink for optical module array assembly
    8.
    发明授权
    Heat sink for optical module array assembly 有权

    公开(公告)号：US09778429B2

    公开(公告)日：2017-10-03

    申请号：US14705189

    申请日：2015-05-06

    Applicant: ProPhotonix (IRL) LTD

    Inventor： Adrian Zagoneanu

    IPC: G02B6/00 ,  G02B6/42

    CPC classification number: G02B6/4269 ,  G02B6/4204 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/428

    Abstract: Apparatus comprising: a heat sink, the heat sink comprising: a body formed out of a heat-transmissive material; at least one channel extending through the body, the at least one channel having an inlet port and an outlet port; at least one opening extending through the body, the at least one opening being configured to receive an optical module therein; at least one securement element mounted to the body for releasably securing an optical module within the at least one opening; and at least one alignment element mounted to the body for ensuring appropriate alignment of an optical module received in the at least one opening.

    OPTICAL MODULE
    9.
    发明申请
    OPTICAL MODULE 审中-公开

    公开(公告)号：US20170254969A1

    公开(公告)日：2017-09-07

    申请号：US15289333

    申请日：2016-10-10

    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.

    Inventor： Xuxia LIU ,  Yongliang HUANG ,  Qian SHAO

    IPC: G02B6/42 ,  G02B6/32

    CPC classification number: G02B6/4214 ,  G02B6/32 ,  G02B6/4246 ,  G02B6/426 ,  G02B6/428 ,  G02B6/4292

    Abstract: The disclosure provides an optical module that includes a circuit board, a first chip, a second chip, and a lens assembly, wherein the first chip and the second chip are arranged respectively on the surface of the circuit board, and the lens assembly is arranged above the first chip and the second chip; the lens assembly includes a first optic fiber insertion port, a second optic fiber insertion port, a first reflecting surface, and a second reflecting surface; the distance between the axis of the first optic fiber insertion port, and the axis of the second optic fiber insertion port is less than the distance between the first chip and the second chip; and the first reflecting surface faces the first chip, the first reflecting surface faces the second reflecting surface, and the second reflecting surface faces the first optic fiber insertion port.

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