公开(公告)号：US20240427657A1

公开(公告)日：2024-12-26

申请号：US18742798

申请日：2024-06-13

Applicant: Micron Technology, Inc.

Inventor： Jianping Tian ,  Da Hong

IPC: G06F11/07 ,  G06F9/4401

Abstract: Various embodiments described herein provide for bootloader failure analysis of a memory system using information regarding a failure of the bootloader, where the information is stored on the memory sub-system in response to detection of (e.g., stored at the time of) the failure. In particular, the stored information can comprise data that would be lost or otherwise inaccessible for subsequent diagnostic (e.g., debug) purposes, such as by a manufacturer of the memory sub-system. According to some embodiments, a memory sub-system is configured to save information regarding a failure of a bootloader, to one or more designated memory devices of the memory sub-system, such that diagnostic firmware (e.g., debug firmware) subsequently loaded and executed on the memory sub-system (e.g., by a manufacturer) can make use of the stored information to perform one or more diagnostic functions (e.g., debug functions) on the memory sub-system.

公开(公告)号：US11726873B2

公开(公告)日：2023-08-15

申请号：US17556550

申请日：2021-12-20

Applicant: Micron Technology, Inc.

Inventor： Da Hong ,  Kexian Huang ,  Qing Xu

IPC: G06F11/30 ,  G06F11/10 ,  G06F11/07 ,  G06F12/02

CPC classification number: G06F11/1068 ,  G06F11/076 ,  G06F11/0772 ,  G06F11/3037 ,  G06F12/0238

Abstract: A system, method and apparatus to optimize repair in a memory module based on hardware errors identified by microprocessors and a configurable error handling policy. For example, the error handling policy can have a configuration file identifying an amount of repair resources available in the memory module as manufactured. Repair status data can be stored in the memory module to determine repair resources currently available for repair. Further, the error handling policy can be configured with a list of high risk memory addresses prioritized for repair. The list can be used to schedule proactive repair in response to memory errors that would otherwise not be repaired during a typical restarting of the computer system having the memory module.

公开(公告)号：US20220318087A1

公开(公告)日：2022-10-06

申请号：US17245761

申请日：2021-04-30

Applicant: Micron Technology, Inc.

Inventor： Da Hong ,  Kexian Huang ,  Qing Xu

IPC: G06F11/07 ,  G06F11/14 ,  G06F11/30

Abstract: A system, method and apparatus to record data relevant to hardware errors identified by microprocessors. For example, in response to a hardware error, a microprocessor can store first data about the error in registers in the microprocessor and start to execute instructions configured in firmware and/or in an operating system. Execution of the instructions in response to the hardware error causes the microprocessor to: generating second data about the error based at least in part on the first data in the registers; and store the second data at a location not affected by restarting execution of an operating system in the processor. For example, the execution of the instructions can cause the microprocessor to decode the first data to obtain a temperature the computing device as part of the second data.

公开(公告)号：US11720438B2

公开(公告)日：2023-08-08

申请号：US17245761

申请日：2021-04-30

Applicant: Micron Technology, Inc.

Inventor： Da Hong ,  Kexian Huang ,  Qing Xu

IPC: G06F11/00 ,  G06F11/07 ,  G06F11/30 ,  G06F11/14

CPC classification number: G06F11/0793 ,  G06F11/0772 ,  G06F11/1407 ,  G06F11/3079

Abstract: A system, method and apparatus to record data relevant to hardware errors identified by microprocessors. For example, in response to a hardware error, a microprocessor can store first data about the error in registers in the microprocessor and start to execute instructions configured in firmware and/or in an operating system. Execution of the instructions in response to the hardware error causes the microprocessor to: generating second data about the error based at least in part on the first data in the registers; and store the second data at a location not affected by restarting execution of an operating system in the processor. For example, the execution of the instructions can cause the microprocessor to decode the first data to obtain a temperature of the computing device as part of the second data.

公开(公告)号：US20230195568A1

公开(公告)日：2023-06-22

申请号：US17556550

申请日：2021-12-20

Applicant: Micron Technology, Inc.

Inventor： Da Hong ,  Kexian Huang ,  Qing Xu

IPC: G06F11/10 ,  G06F11/07 ,  G06F11/30 ,  G06F12/02

CPC classification number: G06F11/1068 ,  G06F11/0772 ,  G06F11/076 ,  G06F11/3037 ,  G06F12/0238

Abstract: A system, method and apparatus to optimize repair in a memory module based on hardware errors identified by microprocessors and a configurable error handling policy. For example, the error handling policy can have a configuration file identifying an amount of repair resources available in the memory module as manufactured. Repair status data can be stored in the memory module to determine repair resources currently available for repair. Further, the error handling policy can be configured with a list of high risk memory addresses prioritized for repair. The list can be used to schedule proactive repair in response to memory errors that would otherwise not be repaired during a typical restarting of the computer system having the memory module.