公开(公告)号：US20020197762A1

公开(公告)日：2002-12-26

申请号：US10193804

申请日：2002-07-11

Applicant: Microscan systems Incorporated

Inventor： Andrew J. Zosel ,  Joel A. Kubby ,  Jingkuang Chen ,  Peter M. Gulvin ,  Chuang-Chia Lin ,  Alex T. Tran

IPC: H01L021/00 ,  H01L021/30 ,  H01L021/46 ,  H01L021/301 ,  H01L021/78

CPC classification number: B81C1/00666 ,  B81B2203/058 ,  B81C2201/014 ,  B81C2201/0164 ,  B81C2201/056 ,  G02B26/0833

Abstract: The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.

Abstract translation: 本发明提供一种微机械或微机电结构。 该结构通过包括在衬底层上限定由绝缘体层分离的单晶硅层上的结构的工艺来制造; 沉积和蚀刻单晶硅层上的多晶硅层，其余的聚硅氧烷形成该结构的机械或光学元件; 暴露单晶硅层的选定区域; 并释放形成的结构。