公开(公告)号：US20210020380A1

公开(公告)日：2021-01-21

申请号：US16930350

申请日：2020-07-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehisa SASABAYASHI ,  Kiyoshiro ISHIBE ,  Kenji UENO ,  Ai FUKUMORI ,  Akihiro TSURU ,  Daisuke HAMADA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12

Abstract: A multilayer electronic component includes a multilayer body including dielectric layers and inner electrode layers. Each of the dielectric layers includes first crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 300 nm and an average aspect ratio of more than or equal to about 5, each of the inner electrode layers includes second crystal grains defining and functioning as plate-shaped objects that have an average thickness of less than or equal to about 150 nm and an average aspect ratio of more than or equal to about 5, where an aspect ratio is represented by a ratio of a major axis of each plate-shaped object to a thickness of the plate-shaped object with the major axis of the plate-shaped object being orthogonal or substantially orthogonal to a thickness direction of the plate-shaped object.

公开(公告)号：US20160093443A1

公开(公告)日：2016-03-31

申请号：US14858059

申请日：2015-09-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro HIRAO ,  Kenji UENO

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/248 ,  H01G4/12 ,  H01G4/012

CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232

Abstract: A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes.

Abstract translation: 陶瓷电子部件包括电子部件陶瓷主体和设置在电子部件主体内的内部电极。 内部电极包括沿厚度方向穿过内部电极的通孔。 陶瓷柱设置在通孔中，并且将陶瓷在内部电极的一侧和另一侧的陶瓷上连接。 位于电子部件主体内部的陶瓷柱与内部电极的端部的面积比大于陶瓷柱与内部电极的中心部分的面积比。

公开(公告)号：US20240212932A1

公开(公告)日：2024-06-27

申请号：US18429623

申请日：2024-02-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenji UENO ,  Shinya ISOTA ,  Yuta OSHIMA

IPC: H01G4/008 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/0085 ,  H01G4/012 ,  H01G4/2325 ,  H01G4/30

Abstract: A multilayer ceramic capacitor includes a multilayer body including an inner layer portion in which multiple inner electrode layers and multiple inner dielectric layers are stacked alternately and two outer layer portions located at the surfaces on two sides of the inner layer portion in the stacking direction, with one outer layer portion on each side, and two outer electrodes located at end surfaces of the multilayer body, which are the surfaces on two sides in the length direction, with one outer electrode at each end surface. The inner electrode layers include outermost inner electrode layers, which are the closest to each of the outer layer portions, and an inside inner electrode layer, which is an inner electrode layer other than the outermost inner electrode layers.